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Epi poly를 이용한 MEMS 소자용 웨이퍼 단위의 진공 패키징에 대한 연구
석선호,이병렬,전국진 한국반도체디스플레이기술학회 2002 반도체디스플레이기술학회지 Vol.1 No.1
A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5$\times10^4$ and the estimated inner pressure was about 1 mTorr. And it is also possible to change the inside pressure of the packaged devices from 2 Torr to 1 mTorr by varying the amount of the Ti gettering material. The long-term stability test is still on the way, but in initial characterization, the yield is about 80% and the vacuum degradation with time was not observed.
김장길,석선호,Nathalie Rolland,Paul-Alain Rolland 한국정밀공학회 2012 International Journal of Precision Engineering and Vol. No.
This paper describes polymer cap 0-level packaging of RF devices, which is based on successive wafer scale bonding and debonding techniques. Pre-fabricated benzocyclobutene (BCB) membranes on a carrier wafer were directly transferred onto a target substrate by wafer scale bonding process. Using an anti-adhesion layer of hydrophobic octadecyltrichlorosilane (OTS) self-assembled monolayer (SAM), the carrier wafer was mechanically detached from the membranes without any aggressive etching process. As a result, BCB packaging caps in various sizes have been successfully fabricated on a 3 inch Si substrate. BCB cap deformation by thermal residual stress was investigated using ANSYS simulation and the measured results were in good agreement with the simulated ones. Si3N4 film was deposited on the caps for hermetic sealing and the hermeticity was evaluated by N2 leak test. Finally, the suitability of BCB caps in RF applications was assessed by S-parameter measurement of gold coplanar waveguide (CPW) transmission lines. The insertion loss change by BCB packaging was negligible and the return loss was better than 20 dB from DC to 50 GHz.