Contact damage of silicon nitride whisker-silicon nitride composites

다국어 초록 (Multilingual Abstract)

The influence of β-silicon nitride whiskers content on Hertzian contact damage in silicon nitride matrix prepared by tape casting and gas pressure sintering (GPS) is discussed. Hertzian indentations with different loads were applied to follow the evolution of damage in these whisker-reinforced composites. Tine morphology of contact damage was investigated by using optical microscopy. as well as electron microscopy. With increasing β-silicon nitride whiskers content in α-silicon nitride, the porosity of materials increased and the microstructure of matrix become finer. With decreasing grain size, the subsurface contact demage increased by increasing crack length. The samples with 2 nuiss% β-silicon nitride addition had showed shallow ring crack and quasi-plastic deformation. On the other hard, for sample with 10 mass% β-silicon nitride whisker added sample and course microst겨ctures subsurface deformation was not observed.

목차 (Table of Contents)

• 1. INTRODUCTION
• 2. EXPERIMENTAL PROCEDURE
• 3. RESULTS AND DISCUSSION
• 4. CONCLUSION
• 5. ACKNOWLEDGEMENTS
• REFERENCES