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    와이어 본딩 기술을 이용한 마이크로 퓨즈 제작 = Micro Fuse Design Using Wire Bonding Technical

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    https://www.riss.kr/link?id=E1034690

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    In this paper, We will have introduced for designed micro fuse(SMD type) using wire bonding technical. The wire bonding technical have used with semiconductor engineering technical development. Using wire bonding technical, made micro fuse have advantage of competitiveness price and simple manufacture technical. For reliability analysis of the fuse element, fusing test of micro fuse in the 250% proportion of rated current, fusing test of micro fuse at each percentage of excess current, micro fusing test of temperature interval, voltage drop test of micro fuse, thermal energy calculation of the micro fuse and the I2t parameters of micro fuse was derived.
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    In this paper, We will have introduced for designed micro fuse(SMD type) using wire bonding technical. The wire bonding technical have used with semiconductor engineering technical development. Using wire bonding technical, made micro fuse have advant...

    In this paper, We will have introduced for designed micro fuse(SMD type) using wire bonding technical. The wire bonding technical have used with semiconductor engineering technical development. Using wire bonding technical, made micro fuse have advantage of competitiveness price and simple manufacture technical. For reliability analysis of the fuse element, fusing test of micro fuse in the 250% proportion of rated current, fusing test of micro fuse at each percentage of excess current, micro fusing test of temperature interval, voltage drop test of micro fuse, thermal energy calculation of the micro fuse and the I2t parameters of micro fuse was derived.

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