http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
이 학술지의 논문 검색
Harvey, I. R.; Turner, D.; Ortowski, J.; Herbert, C. Washington, D.C.; International Microelectronics and Packaging Society and The Microelectronics Foundation 2000 p.001
Reliability and Failure Analysis of CSP under Bending Cycling Test
Huang, T. C.; Lai, D. P.; Ho, S. H.; Lee, J.; Zheng, P. J.; Hwang, J. G.; Wu, J. D. Washington, D.C.; International Microelectronics and Packaging Society and The Microelectronics Foundation 2000 p.009
Corrosion Studies of mBGA Package
Chung, T.-G.; Ahn, S.-H.; Kim, S.; Oh, S. Washington, D.C.; International Microelectronics and Packaging Society and The Microelectronics Foundation 2000 p.015
Single and Multiple Laser Solder Ball Placement and Reflow for Wafer Level CSP
Oppert, T.; Teutsch, T.; Zakel, E.; Azdasht, G. Washington, D.C.; International Microelectronics and Packaging Society and The Microelectronics Foundation 2000 p.021
Flip Chip Ball Grid Array Packaging for RFICs
Hung, C. P.; Wu, L.; Chiu, C. T.; Hsieh, J. S.; Lee, J. J. Washington, D.C.; International Microelectronics and Packaging Society and The Microelectronics Foundation 2000 p.028
A Successful Thick-Film Implementation of a 10 GHz Phase Locked Oscillator Module
Delzer, D. J.; Roland, L. Washington, D.C.; International Microelectronics and Packaging Society and The Microelectronics Foundation 2000 p.034
BGA Reliability of Multilayer Ceramic Integrated Circuit (MCIC) Devices
Fu, C.-Y.; Huang, R.-F. Washington, D.C.; International Microelectronics and Packaging Society and The Microelectronics Foundation 2000 p.040
A Novel Low Cost T/R Module MMIC Protection Scheme
Kritzler, W. R.; Yan, G.; Gorzyca, T.; Guido, R. Washington, D.C.; International Microelectronics and Packaging Society and The Microelectronics Foundation 2000 p.046
Antenna-Integrated Millimeter Wave Transmission Module Technology
Kitaoka, K.; Sakota, N.; Kakimoto, N.; Matsubara, H.; Yamada, A.; Suemastu, E.; Sato, H. Washington, D.C.; International Microelectronics and Packaging Society and The Microelectronics Foundation 2000 p.051
Substrate Characterization: Simulation and Measurement at High Microwave Frequencies
Free, C. E.; Tian, Z.; Barnwell, P. Washington, D.C.; International Microelectronics and Packaging Society and The Microelectronics Foundation 2000 p.057