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이 학술지의 논문 검색
Materials science and engineering - A major topic in the future of microelectronic packaging
Reichl, H.;Michel, B.;Schubert, A. DDP 2000 p.72-73
Production of high precision microparts for machines using metallic glass
Inoue, A.;Kawamura, Y.;Zhang, T.;Saotome, Y. DDP 2000 p.95
Internal stresses and lifetime evaluation of PECVD isolating layers
Dommann, A.;Herres, N.;Krink, M.;Galiano, J. J.;Stampfli, B. DDP 2000 p.96-101
NDE for materials characterization in aeronautic and space applications
Baaklini, G. Y.;Kautz, H. E.;Gyekenyesi, A. L.;Abdul-Aziz, A.;Martin, R. E. DDP 2000 p.102-109
Package reliability studies by experimental and numerical analysis
Schubert, A.;Dudek, R.;Michel, B.;Reichl, H. DDP 2000 p.110-119
Review of industrial applications of CVD diamond
Sussmann, R. S.;Brandon, J. R.;Pickles, C. S. J.;Whitehead, A. J. DDP 2000 p.129-140