Low-dimensional electrical and thermal conductive materials are using vital components of electronics such as electronic circuits, thermal interface materials, transparent electrode, optical devices, etc. We herein summarise the recent advances in our...
Low-dimensional electrical and thermal conductive materials are using vital components of electronics such as electronic circuits, thermal interface materials, transparent electrode, optical devices, etc. We herein summarise the recent advances in our lab. on the percolation networks of nanoscale conductive fillers in polymeric media. Based on 3-D percolation structures, the choice of a more appropriate nanomaterial with a lower percolation threshold can produce highly conductive nanocomposites for various applications, and the materials design can be guided to exploit the full potential of a certain kind of a electrical and thermal conductive filler. After focussing the geometric features (dimension, aspect ratio and size) dependent properties of fillers/polymer matrix and their implications, we highlight unique 3-D percolated techniques that are used to improve the electrical and thermal pathway between the conductive filler materials.