반도체 세정 공정 평가를 위한 나노입자 안착 시스템 개발 = Development of Particle Deposition System for Cleaning Process Evaluation in Semiconductor Fabrication

다국어 초록 (Multilingual Abstract)

As the minimum feature size decrease, control of contamination by nanoparticles is getting more attention in semiconductor process. Cleaning technology which removes nanoparticles is essential to increase yield. A reference wafer on which particles with known size and number are deposited is needed to evaluate the cleaning process. We simulated particle trajectories in the chamber by using FLUENT. Charged monodisperse particles are generated using SMPS (Scanning Mobility Particle Sizer) and deposited on the wafer by electrostatic force. The Experimental results agreed with the simulation results well. We calculate the particles loss in pipe flow theoretically and compare with the experimental results.

참고문헌 (Reference)

1 "정전효과가 있는 가열 수평웨이퍼로의 입자침착에 관한 해석" 21 (21): 1284-1293, 1997

2 "웨이퍼 표면상의 입자침착에 관한 수치 시뮬레이션" 17 (17): 2315-2328, 1993

3 "수직 웨이퍼상의 입자 침착속도의 측정" 7 (7): 521-527, 1995

4 "Aerosol Technology : Properties, Behavior, and Measurement of Airborne Particles 2nd Ed" John Wiley & sons, Inc., New York 1999

5 "A Particle Deposition System for the Preparation of Standard Calibration Wafers" 43 (43): 84-92, 1997

6 "300mm 웨이퍼 위의 에어로졸 나노 입자의 증착 장비 개발을 위한 수치 해석적 연구" 4 (4): 49-53, 2005