The development of the surface micromachining process for micro gyroscope fabrication is presented in this paper. The 5.3㎛ thickness of doped polysilicon actuator structures have been fabricated successfully with using multi step polysilicon deposit...
The development of the surface micromachining process for micro gyroscope fabrication is presented in this paper. The 5.3㎛ thickness of doped polysilicon actuator structures have been fabricated successfully with using multi step polysilicon deposition and POCl₃ doping process, and also by using HF gas-phase etching process for 1.5 ㎛ thickness of sacrificial oxide. After annealing and sacrificial oxide removal, the final compressive stress and stress gradient in the doped polysilicon is measured as 46 MPa and -0.5 MPa/㎛, respectively.