The current paper reviews the research conducted on wrought Cu–Sn, Cu–Sn–Ti and Cu–Sn–Zn alloys intending to revealthe details on morphological and mechanical behaviour during various manufacturing operations. The motivational force ofemploy...

http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
https://www.riss.kr/link?id=A107918139
M. Karthik (Amrita Vishwa Vidyapeetham) ; J. Abhinav (Amrita Vishwa Vidyapeetham) ; Karthik V. Shankar (Amrita Vishwa Vidyapeetham)
2021
English
KCI등재,SCI,SCIE,SCOPUS
학술저널
1915-1946(32쪽)
0
0
상세조회0
다운로드다국어 초록 (Multilingual Abstract)
The current paper reviews the research conducted on wrought Cu–Sn, Cu–Sn–Ti and Cu–Sn–Zn alloys intending to revealthe details on morphological and mechanical behaviour during various manufacturing operations. The motivational force ofemploy...
The current paper reviews the research conducted on wrought Cu–Sn, Cu–Sn–Ti and Cu–Sn–Zn alloys intending to revealthe details on morphological and mechanical behaviour during various manufacturing operations. The motivational force ofemploying copper-based alloys in automotive and marine industries is its mechanical properties and corrosion resistance.
One of the important factors that afect mechanical properties is micrograph. The grain size, grain distribution, heat treatment, morphological behaviour and the intermediate phase formation highly infuence the properties of the copper-basedalloys. Moreover, the change in microstructure through diferent manufacturing process (wrought process), heat treatmentand addition of alloying element also improve the mechanical and thermal properties. This paper aims to review the majorconclusions on improving the microstructure and mechanical behaviour of wrought Cu–Sn, Cu–Sn–Zn and Cu–Sn–Ti alloys.
Analysis and observations of each investigation were prepared by incorporating the morphological results obtained throughOptical Microscope, Transmission Electron Microscope, Scanning Electron Microscope, X-ray Difraction Technique andElectron Dispersive Spectroscopy. This review paper also attempts to give the areas of future researches and developmentsthat can be made for these wrought alloys.
참고문헌 (Reference)
1 W. Gierlotka, 22 : 3158-, 2007
2 O. Minho, 120 : 133-, 2014
3 A. Banerjee, 262 : 200-, 2015
4 J. Hui, 5 : 046511-, 2018
5 H. Liu, 853-857, 2010
6 I. Panchenko, 102 : 113296-, 2019
7 Q. Lin, 767 : 877-, 2018
8 V. A. Baheti, 727 : 832-, 2017
9 M. Onishi, 16 : 539-, 1975
10 S. Kumar, 32 : 309-, 2011
1 W. Gierlotka, 22 : 3158-, 2007
2 O. Minho, 120 : 133-, 2014
3 A. Banerjee, 262 : 200-, 2015
4 J. Hui, 5 : 046511-, 2018
5 H. Liu, 853-857, 2010
6 I. Panchenko, 102 : 113296-, 2019
7 Q. Lin, 767 : 877-, 2018
8 V. A. Baheti, 727 : 832-, 2017
9 M. Onishi, 16 : 539-, 1975
10 S. Kumar, 32 : 309-, 2011
11 L. Révay, 5 : 57-, 1977
12 A. Paul, 42 : 952-, 2011
13 S. Bader, 43 : 329-, 1995
14 Y. Yuan, 661 : 282-, 2016
15 M. Arita, 32 : 32-, 1991
16 J. Feng, 753 : 203-, 2018
17 L. Wu, 217 : 120-, 2018
18 L. C. Tsao, 53 : 25-, 2018
19 J. He, 753–755 : 353-, 2013
20 J. Zhang, 762 : 602-, 2013
21 X. Y. Xue, 19 : 557-, 2003
22 S. Fürtauer, 34 : 142-, 2013
23 X.J. Liu, 35 : 1641-, 2004
24 D. Li, 34 : 148-, 2013
25 E. D. Kizikov, 17 : 61-, 1975
26 S. Hamar-Thibault, 57-, 1999
27 S. Hamar-Thibault, 317 : 363-, 2001
28 M. Naka, 22 : 352-, 2001
29 X. Zhang, 480 : 382-, 2009
30 G. J. Zhou, 7 : 025118-, 2017
31 J. Wang, 35 : 82-, 2011
32 B. Wierzba, 523 : 602-, 2019
33 M. De Bondt, 15 : 993-, 1967
34 Z. J. Wang, 32 : 139-, 2013
35 G. Ross, IEEE 459-467, 2017
36 G. Ross, 677 : 127-, 2016
37 K. N. Tu, 21 : 347-, 1973
38 K. Fujiwara, 70 : 153-, 1980
39 K. N. Tu, 30 : 947-, 1982
40 K. N. Tu, 49 : 2030-, 1994
41 R. Chopra, 94 : 279-, 1982
42 R. Chopra, 86 : 43-, 1981
43 K. N. Tu, 46 : 217-, 1996
44 F. Keraghel, 21 : 152-, 2011
45 X. Wang, 24 : 803-, 2008
46 C. Lei, 301 : 356-, 2016
47 A. Nassef, 2016 : 9796169-, 2016
48 R. Tongsri, 113 : 52-, 2016
49 J. D. Stice, 13 : 1687-, 1982
50 M. Kamal, 161 : 189-, 2006
51 M. Ceylan, 97 : 148-, 2000
52 N. Kuwano, 24 : 504-, 1983
53 N. Kuwano, 24 : 561-, 1983
54 Z. Mao, 721 : 125-, 2018
55 S. Amore, 452 : 161-, 2008
56 W. Zhai, 60 : 6518-, 2012
57 W. Zhai, 72 : 43-, 2015
58 Y. Su, 43 : 4219-, 2012
59 H. Lu, 26 : 753-, 2006
60 J. W. Xian, 126 : 540-, 2017
61 H. Liu, 41 : 2453-, 2012
62 A. Rautiainen, 4 : 7093-, 2017
63 I. Panchenko, 117 : 26-, 2014
64 H. Liu, 1 : 1350-, 2011
65 J. Liu, IEEE 10-13, 2017
66 N. S. Bosco, 53 : 2019-, 2005
67 N. S. Bosco, 52 : 2965-, 2004
68 M. S. Park, 60 : 6278-, 2012
69 M. S. Park, 54 : 1401-, 2014
70 W. Fan, 5 : 106520-, 2018
71 T. Takenaka, 396 : 115-, 2005
72 P. Han, 53 : 38-, 2014
73 M. Sobiech, 26 : 1482-, 2011
74 H. Kato, 43 : 361-, 1995
75 L. N. Dyachkova, 31 : 1226-, 2015
76 J. Hui, 144 : 611-, 2018
77 J. Liu, 26 : 29-, 2020
78 K. Murase, 158 : D335-, 2011
79 A. Ito, 77 : 677-, 2009
80 Z. Yin, 215 : 207-, 2017
81 S. Buhl, 3 : 16-, 2012
82 J. Hui, 36 : 68-, 2019
83 J. Hui, 53 : 15308-, 2018
84 H. Morikawa, 8 : 145-, 1967
85 N. Kuwano, 24 : 499-, 1983
86 M. B. Cortie, 22 : 11-, 1991
87 C. Hang, 24 : 3905-, 2013
88 H. M. Mallikarjuna, 26 : 1755-, 2016
89 K. Yoshida, 40 : 8-, 2011
90 B. Subramanian, 201 : 1145-, 2006
91 H. Kim, 491 : 221-, 2005
92 N. Hoivik, IEEE 526-, 2010
93 P. Han, 154 : 359-, 2018
94 Y. W. Wang, 799 : 108-, 2019
95 C. Schmetterer, 38 : 10-, 2009
96 J. S. L. Pak, 130 : 83-, 1989
97 Y. Muranishi, 404 : 33-, 2005
98 K. Osamura, 21 : 1509-, 1986
99 T. Yamashina, 47 : 829-, 2006
100 F. Wang, 53 : 699-, 2005
101 J. Yin, 29 : 770-, 2014
102 V. Vuorinen, 23 : 68-, 2012
103 T. Hayase, 433 : 83-, 2006
104 K. I. Mikami, 42 : 8178-, 2007
105 Y. Muranishi, 404 : 33-, 2005
106 C. C. Lin, 36 : 2145-, 2001
107 Y. Tejima, 45 : 919-, 2010
108 Y. C. Hsieh, 466 : 126-, 2008
109 O. Dezellus, 44 : 2543-, 2001
110 W. Tillmann, 88 : 172-, 2014
111 B. Zhao, 730 : 345-, 2018
112 B. Zhao, 28 : 315-, 2018
113 B. Zhao, 30 : 2004-, 2017
114 C. Y. Ma, 65 : 50-, 2015
115 M. Y. Tsai, 494 : 123-, 2010
116 Y. Ye, 612 : 246-, 2014
117 S. K. Ghosh, 54 : 6652-, 1983
118 S. K. Halder, 17 : 492-, 1979
119 S. Hong, 565 : 153-, 2012
120 T. P. Dhakal, 100 : 23-, 2014
121 J. J. Scragg, 646 : 52-, 2010
122 S. A. Vanalakar, 619 : 109-, 2015
123 R. T. Mathew, 725 : 818-, 2017
124 F. A. El-salam, 23 : 341-, 2000
125 M. Peng, 247 : 185-, 1997
126 Y. Huang, 477 : 283-, 2009
127 W. Gierlotka, 23 : 258-, 2008
128 K. Yamaguchi, 11 : 1330-, 1932
129 C. Y. Chou, 54 : 2393-, 2006
130 T. Jantzen, 22 : 417-, 1998
131 O. Bauer, 22 : 405-, 1930
132 D. D. Perovic, 28 : 120-, 2012
133 J. Miettinen, 26 : 119-, 2002
134 H. Wada, 13 : 1943-, 1943
135 S. D. Beattie, 152 : C542-, 2005
136 S. Scudino, 156 : 202-, 2015
137 G. M. Karthik, 13 : 100861-, 2020
138 A. Munding, "Wafer Level 3-D ICs Process Technology" Springer 2008
139 H. Fujiwara, "Microstructure and Mechanical Properties of Cu-Sn Alloy with Harmonic Structure" Springer 2455-2460, 2013
140 신재혁, "Fabrication of Supersaturated Cu-Sn Alloy Sheets and their Antibacterial Properties" 대한금속·재료학회 17 (17): 441-444, 2011
Wear Resistance of Different Bionic Structure Manufactured by Laser Cladding on Ti6Al4V
학술지 이력
| 연월일 | 이력구분 | 이력상세 | 등재구분 |
|---|---|---|---|
| 2023 | 평가 | 해외DB학술지평가 신청대상 (해외등재 학술지 평가) | |
| 2020-01-01 | 등재 | 등재학술지 유지 (해외등재 학술지 평가) | ![]() |
| 2009-12-29 | 학회명변경 | 한글명 : 대한금속ㆍ재료학회 -> 대한금속·재료학회 | ![]() |
| 2008-01-01 | 등재 | SCI 등재 (등재유지) | ![]() |
| 2005-01-01 | 등재 | 등재학술지 선정 (등재후보2차) | ![]() |
| 2004-01-01 | 등재 | 등재후보 1차 PASS (등재후보1차) | ![]() |
| 2002-01-01 | 등재 | 등재후보학술지 선정 (신규평가) | ![]() |
학술지 인용정보
| 기준연도 | WOS-KCI 통합IF(2년) | KCIF(2년) | KCIF(3년) |
|---|---|---|---|
| 2016 | 2.05 | 0.91 | 1.31 |
| KCIF(4년) | KCIF(5년) | 중심성지수(3년) | 즉시성지수 |
| 1.03 | 0.86 | 0.678 | 0.22 |