Electronic hardware has become a critical part of automobiles and the dependence on electronic system is expected to continue to increase. The reliability of electronic hardware that is responsible for operation and safety features on automobiles is a...
Electronic hardware has become a critical part of automobiles and the dependence on electronic system is expected to continue to increase. The reliability of electronic hardware that is responsible for operation and safety features on automobiles is a critical design concern. This paper presents the use of techniques for simulating product qualification as well as for product testing of automotive electronic hardware. The mechanical performance of these packages is studied using finite element analysis for given temperature and vibration environments in automotive applications. The system level model is correlated through vibration experiments. To determine the level of loads at the failure site, the test vehicle was instrumented with sensors (strain gages, thermal couples and accelerometers). Using the results of vibration and thermal simulations, fatigue life is predicted based on cumulative damage analysis and material durability information.