고분자 기판의 휨 스트레스에 대한 Encapsulation층의 효과 = The Effect of Encapsulation Layer Incorporated into Polymer Substrates for Bending Stress

다국어 초록 (Multilingual Abstract)

In this study, we investigated the necessity of encapsulation layer to maximize flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer han a significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that han a significant effect on internal thermal stress. To compare the magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

참고문헌 (Reference)

1 "Study on electrical characteristics of plastic ITO film with bending on multi-barrier films" 17 (17): 2004.

2 "Strain- dependent electrical resistance of tin-doped indium oxide on polymer substrate" 76 (76): 1425-, 2000.

3 "Statistical analysis of multiple cracking phenomenon of a SiOx thin film on a polymer substrate" 90 (90): 713-, 2001.

4 "Position dependent stress distribution of indium-tin- oxide on polymer substrate by external bending force" in press

5 "Modeling of elastic defor- mation of multilayers due to residual stres- ses and external bending" 91 (91): 9652-, 2002.

6 "Mechanics of rollable and foldable film-on-foil electronics" 74 (74): 1177-, 1999.

7 "Mechanical analysis of ultrathin oxide coatings on polymer substrates in situ in a scanning electron microscope" 437 : 204-, 2003.

8 "Improvement of mechanical property of indium-tin-oxide films on polymer substrates by using organic buffer layer" 3. no. 2 : 32-, 2002.

9 "Figure of merit for deposition conditions in ITO Films" 3. (3.): 6-, 2002.