Microstructural Characterization and Properties of Al/Cu/Steel Diffusion Bonded Joints

다국어 초록 (Multilingual Abstract)

We prepared Al/Cu/steel composite with a gradient structure using a vacuum hot-pressed diffusion method and investigated the Al/Cu/steel interface. The results show that a supersaturated solid solution with a thickness of about 2 um formed in the Cu/steel diffusion zone. Two kinds of intermetallic compounds, Cu9Al4 adjacent to the Cu side and CuAl2 adjacent to the Al side, formed at the interface of the Al/Cu. The thickness of the intermetallic compound layer appeared to greatly affect conductivity and tensile strength. The conductivity and the tensile strength decreased from 36.9 MS/m to 24.2 MS/m, and from 70.9MPa to 40.7MPa, respectively,while the thickness increased from 3.5 um to 23 um. The fractures occurred between a supersaturated solid solution (Al in Cu) and Cu9Al4, or between Cu9Al4 and CuAl2.

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