초소형 초경 PCD Tool 제작을 위한 초경합금간 확산접합의 온도 의존성 연구

다국어 초록 (Multilingual Abstract)

This studydemonstrates the diffusion bonding process between a tungsten carbide shank (K30) and tungsten carbide (DX5) for micro WC-PCD tool fabrication. A type of nickel alloy was used as the filler metalto improve the bondability between K30 and DX5. The bonding pressure, time, and surrounding conditions were kept constant. In particular, the normal pressure was controlled precisely under buckling analysis. Diffusion bonding was performed at various operationtemperatures (1170?1770 K) by usinga specially designed jig. The microstructure on the localized bonded surface was analyzed using scanning electron microscopyand optical microscopy.In the case of diffusion bonding of WCat 1370?1770K, the filler metal melted completelyand diffused between the two base metals, and they were bonded more tightly on both sides thanat temperatures below 1370 K.Our results demonstrated the importance of sensitive temperature dependence of diffusion bonding.

참고문헌 (Reference)

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