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      알루미늄의 브레이징과 원리 = Aluminum Brazing and Its Principle

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      https://www.riss.kr/link?id=A104606621

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      다국어 초록 (Multilingual Abstract) kakao i 다국어 번역

      Aluminum alloys have been widely used in many fields such as electronic, structure, aero-space and vehicle industries due to their outstanding thermal and electrical conductivity as well as low cost. However, they have some difficulties for using in brazing process because of the strong oxide layer of Al2O3 on the surface of Al alloy. In addition, their melting point is similar to that of brazing filler metal resulting in thermal damage of Al alloys. Therefore, it is very important to understand the brazing principles, filler metal and its properties such as wetting, capillary flow and dissolution of base metal in the Al brazing process. This paper reviews the brazing principles, aluminum alloys, and brazing fillers.
      In the case of brazing principle, some formula was used for calculation of capillary force and the dissolution to obtain the best condition of Al brazing. In addition, the advanced research trends in Al brazing were introduced including thermal treatment, additive for improving property and decreasing melting point in Al brazing process.
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      Aluminum alloys have been widely used in many fields such as electronic, structure, aero-space and vehicle industries due to their outstanding thermal and electrical conductivity as well as low cost. However, they have some difficulties for using in b...

      Aluminum alloys have been widely used in many fields such as electronic, structure, aero-space and vehicle industries due to their outstanding thermal and electrical conductivity as well as low cost. However, they have some difficulties for using in brazing process because of the strong oxide layer of Al2O3 on the surface of Al alloy. In addition, their melting point is similar to that of brazing filler metal resulting in thermal damage of Al alloys. Therefore, it is very important to understand the brazing principles, filler metal and its properties such as wetting, capillary flow and dissolution of base metal in the Al brazing process. This paper reviews the brazing principles, aluminum alloys, and brazing fillers.
      In the case of brazing principle, some formula was used for calculation of capillary force and the dissolution to obtain the best condition of Al brazing. In addition, the advanced research trends in Al brazing were introduced including thermal treatment, additive for improving property and decreasing melting point in Al brazing process.

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      참고문헌 (Reference)

      1 A. C. Hall, "Visual observations of liquid filler metal flow within braze gap" 9 (9): 95-, 2002

      2 J. Yan, "Ultrasonic assisted fabrication of particle reinforced bonds joining aluminum metal matrix composites" 32 (32): 343-, 2011

      3 W. Dai, "Torch brazing 3003 aluminum alloy with Zn-Al filler metal" 22 : 30-, 2012

      4 Z. Wang, "Three-dimensional graphene-reinforced cu foam interlayer for brazing C/C composites and Nb" 118 : 723-, 2017

      5 N. Fries, "The transition from inertial to viscous flow in capillary rise" 327 : 125-, 2008

      6 S. Z. Lu, "The mechanism of silicon modification in aluminum-silicon alloys:impurity induced twinning" 18 : 1721-, 1987

      7 D. U. Kim, "The effect of grain boundary on the dissolution of base metal into insert metal during TLP bonding of Ni-Base super alloy" 5 (5): 377-, 1999

      8 M. M. Makhlouf, "The aluminum silicon eutectic reaction: mechanisms and crystallography" 1 : 199-, 2001

      9 E. W. Washburn, "The Dynamics of Capillary Flow" 17 (17): 273-, 1921

      10 M. P. Heisler, "Temperature chart for induction and constant heating" 69 (69): 227-, 1947

      1 A. C. Hall, "Visual observations of liquid filler metal flow within braze gap" 9 (9): 95-, 2002

      2 J. Yan, "Ultrasonic assisted fabrication of particle reinforced bonds joining aluminum metal matrix composites" 32 (32): 343-, 2011

      3 W. Dai, "Torch brazing 3003 aluminum alloy with Zn-Al filler metal" 22 : 30-, 2012

      4 Z. Wang, "Three-dimensional graphene-reinforced cu foam interlayer for brazing C/C composites and Nb" 118 : 723-, 2017

      5 N. Fries, "The transition from inertial to viscous flow in capillary rise" 327 : 125-, 2008

      6 S. Z. Lu, "The mechanism of silicon modification in aluminum-silicon alloys:impurity induced twinning" 18 : 1721-, 1987

      7 D. U. Kim, "The effect of grain boundary on the dissolution of base metal into insert metal during TLP bonding of Ni-Base super alloy" 5 (5): 377-, 1999

      8 M. M. Makhlouf, "The aluminum silicon eutectic reaction: mechanisms and crystallography" 1 : 199-, 2001

      9 E. W. Washburn, "The Dynamics of Capillary Flow" 17 (17): 273-, 1921

      10 M. P. Heisler, "Temperature chart for induction and constant heating" 69 (69): 227-, 1947

      11 K. Allen, "Solving the problems inherent to torch brazing aluminum" 39 : 2009

      12 R. J. Klein, "Soldering in electronics"

      13 P. T. Viance, "Soldering handbook" American Welding Society 1999

      14 D. M. Jacobson, "Principles of Brazing II" ASM international 1-14, 2005

      15 T. I. Yoo, "Practical brazing technology" Engineering information 2005

      16 A. Knuutinen, "Modification of Al-Si alloys with Ba, Ca, Y and Yb" 1 : 229-, 2001

      17 H. Nakagawa, "Modeling of base metal dissolution behavior during transient liquid phase brazing" 22 (22): 543-, 1991

      18 J. H. Lee, "Microstructure and mechanical property of joint of Al-Steel laser brazing using Cu filler metal" 174 : 2016

      19 C. S. Kang, "Micro joining" Samsung-Books 22-23, 2002

      20 A. Mathieu, "Laser brazing of a steel/aluminium assembly with hot filler wire (88%Al, 12%Si)" 435-436 : 19-, 2006

      21 R. W. Messler. Jr, "Joining of advanced materials" Butterworth - Heinemann 3-16, 1993

      22 S. Chen, "Joing mechanism of Ti/Al dissimilar alloys during laser welding-brazing process" 509 : 891-, 2011

      23 D. Gupta, "Interface diffusion in eutectic Pb-Sb solder" 47 : 5-, 1998

      24 K. Elangovana, "Influences of post-weld heat treatment on tensile properties of friction stirwelded aa6061 aluminum alloy joints" 59 : 1168-, 2008

      25 H. T. Lee, "Influence of intermetallic compounds on the adhesive strength of solder joints" 333 : 24-, 2002

      26 V. Rudnev, "Handbook of induction heating" 61 : 80-98, 2003

      27 W. E. Cooke, "Furnace brazing of aluminum with a non-corrosive flux" SAE 1978

      28 J. N. Antonevichm, "Fundamentals of ultrasonic soldering" 55 (55): 200-, 1976

      29 A. Tressaud, "Functionalized Inorganic Fluorides" John Wiley & Sons Ltd 214-221, 2010

      30 K. Nogita, "Eutectic modification of Al-Si alloys with rare earth metals" 45 : 323-, 2004

      31 Y. Li, "Dissolution of TiAl alloy during high temperature brazing" 48 (48): 5247-, 2013

      32 K. Barmak, "Dissolution kinetics of nickel in lead-free Sn0Bi-In-Zn-Sb soldering alloys" 993 : 0993-E03-0-, 2007

      33 M. Ding, "Direct soldering 6061 aluminum alloys with ultrasonic coating" 17 : 292-, 2010

      34 C. Cui, "Development of low-melting-point filler materials for laser beam brazing of aluminum alloys" 45 (45): 717-, 2014

      35 D. J. Fray, "Determination of sodium in molten aluminum and aluminum alloys using beta alumina probe" 8 (8): 153-, 1977

      36 M. H. Sloboda, "Design and Strength of Brazed Joints" Johnson Matthey & Co limited 3-6, 1961

      37 H. C. Lia, "Correlation between mechanical properties and amount of dendritic α-Al phase in as-cast near eutectic Al-11.6%Si alloys modified with strontium" 335 : 62-, 2002

      38 H. Zhao, "Capillary Flow of Liquid Metal Occurring in Microchannel Heat Exchanger Fabrication"

      39 X. Song, "Brazing of C/C composites to Ti6Al4V using multiwall carbon nanotubes reinforced TiCuZrNi brazing alloy" 664 : 175-, 2016

      40 X. Song, "Brazing of C/C composites to Ti6Al4V using grapheme nanoplates reinforced TiCuZrNi brazing alloy" 183 : 232-, 2016

      41 D. Claydon, "Brazing aluminum automotive heat exchanger assemblies using a non-corrosive flux process" SAE 1983

      42 M. Naka, "Applying of ultrasonic waves on brazing of alumina to copper using Zn-Al filler alloy" 38 (38): 3491-, 2003

      43 J. E. Hatch, "Aluminum:properties and physical metallurgy"

      44 M. Craig, "Aluminum brazing –what matter most:fundamentals and case studies"

      45 Ashutosh Sharma, "Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications" 한국마이크로전자및패키징학회 22 (22): 1-5, 2015

      46 C. Hunt, "A test methodology for copper dissolution in lead-free alloys"

      47 A. Shen, "A model for capillary rise in nano-channels with inherent surface roughness" 110 : 121601-, 2017

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      2022 평가예정 계속평가 신청대상 (계속평가)
      2021-12-01 평가 등재후보로 하락 (재인증) KCI등재후보
      2018-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2015-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2011-06-28 학술지명변경 한글명 : 마이크전자 및 패키징학회지 -> 마이크로전자 및 패키징학회지
      외국어명 : The Microelectronics and Packaging Society -> Jornal of the Microelectronics and Packaging Society
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      2011-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2009-01-01 평가 등재 1차 FAIL (등재유지) KCI등재
      2007-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2004-01-01 평가 등재학술지 선정 (등재후보2차) KCI등재
      2003-01-01 평가 등재후보 1차 PASS (등재후보1차) KCI등재후보
      2001-07-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
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      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 0.48 0.48 0.43
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.39 0.35 0.299 0.35
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