A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from ...
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https://www.riss.kr/link?id=A82517139
2005
-
550
학술저널
21-26(6쪽)
0
상세조회0
다운로드다국어 초록 (Multilingual Abstract)
A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from ...
A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.
목차 (Table of Contents)
Photoreflectance 측정에 의한 InxGal-xP의 특성 연구
용가 와이어를 이용한 알루미늄 레이저 용접부의 용접 특성에 관한 연구