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Packaging for Microelectromechanical and Nanoelectromechanical Systems
Lee, Y. C.; Parviz, B. A.; Chiou, J. A.; Chen, S. IEEE 2003 p.217-226
Single Wafer Encapsulation of MEMS Devices
Candler, R. N.; Park, W.-T.; Li, H.; Yama, G.; Partridge, A.; Lutz, M.; Kenny, T. W. IEEE 2003 p.227-232
Using Self-Assembly for the Fabrication of Nano-Scale Electronic and Photonic Devices
Parviz, B. A.; Ryan, D.; Whitesides, G. M. IEEE 2003 p.233-241
Polydimethylsioxane Fluidic Interconnects for Microfluidic Systems
Li, S.; Chen, S. IEEE 2003 p.242-247
Ramadoss, R.; Lee, S.; Lee, Y. C.; Bright, V. M.; Gupta, K. C. IEEE 2003 p.248-254
The Package Integration of RF-MEMS Switch and Control IC for Wireless Applications
De Silva, A. P.; Hughes, H. G. IEEE 2003 p.255-260
Lin, Y.-C.; Chiou, J.-C.; Lin, W.-T.; Lin, Y.-J.; Wu, S.-D. IEEE 2003 p.261-267
Solder-Assembled Large MEMS Flaps for Fluid Mixing
Ma, Z.; Bradley, E.; Peacock, T.; Hertzberg, J. R.; Lee, Y.-C. IEEE 2003 p.268-276
Chip-Level Vacuum Packaging of Micromachines Using NanoGetters
Sparks, D. R.; Massoud-Ansari, S.; Najafi, N. IEEE 2003 p.277-282
Laser-Assisted Sealing and Testing for Ceramic Packaging of MEMS Devices
Tao, Y.; Malshe, A. P.; Brown, W. D.; DeReus, D. R.; Cunningham, S. IEEE 2003 p.283-288