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Basaran, C.; Wen, Y. IEEE 2006 p.666-673
Exposed Die-Top Encapsulation Molding for an Improved High-Performance Flip Chip BGA Package
Chong, D. Y. R.; Lim, B. K.; Rebibis, K. J.; Pan, S. J.; Sivalingam, K.; Kapoor, R.; Sun, A. Y. S.; Tan, H. B. IEEE 2006 p.674-682
Epitaxy-Like Protective Layers for High-Performance Low-Cost Au/Pd
Liu, L.; Liu, D.; Fu, R.; Kwan, Y. F.; Yau, C. H.; Zhang, T.-Y. IEEE 2006 p.683-689
Qi, Y.; Ghorbani, H. R.; Spelt, J. K. IEEE 2006 p.690-700
Anisotropic Conductive Film Bonding by Making Use of a High-Power Diode Laser
Ryu, K. H.; Kwon, N.; Seo, M. H.; Lee, M. H.; Nam, G. J.; Kwak, N. H. IEEE 2006 p.701-706
Pan, J.; Pafchek, R. M.; Judd, F. F.; Baxter, J. B. IEEE 2006 p.707-713
A Study of Permittivity Measurement Reproducibility Utilizing the Agilent 4291B
Hill, M. J.; Wojewoda, L. E. IEEE 2006 p.714-718
Thermosonic Flip Chip Interconnection Using Electroplated Copper Column Arrays
Gao, S.; Holmes, A. S. IEEE 2006 p.725-734
Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages
Chan, Y. C.; Tan, S. C.; Lui, N. S. M.; Tan, C. W. IEEE 2006 p.735-740