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Shinichi Sasaki Institute of Electrical and Electronics Engineers 1999 p.p541
Thiompson, Rick L Institute of Electrical and Electronics Engineers 1999 p.p649
Die Cracking and Reliable Die Design for Flip-Chip Assemblies
Michaelides, Stylianos Institute of Electrical and Electronics Engineers 1999 p.p602
Zhengyu Yuan Institute of Electrical and Electronics Engineers 1999 p.p665
Linden, Johan E. van der Institute of Electrical and Electronics Engineers 1999 p.p534
Manufacturing of CU/Electroless Nickel/Sn-Pb Flip Chip Solder Bumps
Kwang-Lung Lin Institute of Electrical and Electronics Engineers 1999 p.p575
Manufacturing of Solder Bumps with Cu/Ta/Cu as Under Bump Metallurgy
Kwang-Lung Lin Institute of Electrical and Electronics Engineers 1999 p.p580
A New Flip-Chip Bonding Technique Using Micromachined Conductive Polymer Bumps
Oh, Kwang W Institute of Electrical and Electronics Engineers 1999 p.p586
Goossen, Keith W Institute of Electrical and Electronics Engineers 1999 p.p561
Packaging for a 40-Channel Parallel Optical Interconnection Module with An Over-25-Gbit/s Throughput
Kohsuke Katsura Institute of Electrical and Electronics Engineers 1999 p.p551