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A 3-D Stacked Chip Packaging Solution for Miniaturized Massively Parallel Processing
Lea, R. Michael Institute of Electrical and Electronics Engineers 1999 p.p424
Accurate Power Supply and Ground Plane Pair Models
Wu, Henry Hungjen Institute of Electrical and Electronics Engineers 1999 p.p259
Characterization of Thin Film Tantalum Oxide Capacitors on Polyimide Substrates
Morcan, Gabriel Institute of Electrical and Electronics Engineers 1999 p.p499
Ishitsuka, Fuminori Institute of Electrical and Electronics Engineers 1999 p.p451
Contribution of Resonance to Ground Bounce in Lossy Thin Film Planes
Pannala, Sreemala Institute of Electrical and Electronics Engineers 1999 p.p249
Asai, Hironori Institute of Electrical and Electronics Engineers 1999 p.p460
Efficient Computation of Interconnect Capacitances Using the Domain Decomposition Approach
Veremey, Vladimir V Institute of Electrical and Electronics Engineers 1999 p.p348
Electrical Characterization of Ball Grid Array Packages from S-Parameter Measurements Below 500 MHz
Jeong, Jaeyong Institute of Electrical and Electronics Engineers 1999 p.p343
Electrical Characterization of Integrated Circuit Molding Compound
Green, Christopher C Institute of Electrical and Electronics Engineers 1999 p.p337
Electrical Design and Simulation of High Density Printed Circuit Boards
Swirbel, Tom Institute of Electrical and Electronics Engineers 1999 p.p416