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High-Density Packaging for Mobile Terminals
Pienimaa, S. K.; Martin, N. I. IEEE 2004 p.467-475
Chungpaiboonpatana, S.; Shi, F. G. IEEE 2004 p.476-489
A Wafer-Level Microcap Array to Enable High-Yield Microsystem Packaging
Chiang, Y.-M. J.; Bachman, M.; Li, G. P. IEEE 2004 p.490-496
High-Speed Interconnects With Underlayer Orthogonal Metal Grids
Wang, P.; Kan, E. C. IEEE 2004 p.497-507
Materials and Processes for Implementing High-Temperature Liquid Interconnects
Mannan, S. H.; Clode, M. P. IEEE 2004 p.508-514
Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability
Zhang, Z.; Wong, C. P. IEEE 2004 p.515-524
Novel Reworkable Fluxing Underfill for Board Level Assembly
Zhang, Z.; Li, H.; Wong, C. P. IEEE 2004 p.525-532
Enhancement of Underfill Capillary Flow in Flip-Chip Packaging by Means of the Inertia Effect
Lin, C.-M. IEEE 2004 p.533-539