Ni Sulfamate-chloride 전기도금 용액에서 전류밀도와 첨가제의 농도 변화가 Ni 박막에 미치는 영향

다국어 초록 (Multilingual Abstract)

Sulfamate plating solution containing a small amount of chloride bath was fabricated to study the properties of the electrodeposited Ni thin films. Effects of the changes of current density and additive concentration on current efficiency, residual stress, surface morphology and microstructure of Ni thin films electrodeposited from Ni sulfamate-chloride baths were investigated. The current efficiency was measured to be more than about 95%, independent of the changes of current density and saccharin concentration in the baths. Residual stress of Ni thin film was appeared to be the compressive stress modes in the range of 5~30 mA/㎠ current density. Maximum compressive stress was observed at the current density of 10 mA/㎠. Compressive stress values of Ni thin/thick films were increased to be about -85~-100 MPa with increasing saccharin concentration from 0 to 0.0195 M(4 g/L). Surface morphology was changed from smooth to nodule surface appearance with increasing the current density. Smooth surface morphology of Ni thin films electrodeposited from the baths containing saccharin was observed, independent of the saccharin concentration. Ni thin/thick films consist of FCC(111), FCC(200), FCC(220), FCC(311) and FCC(222) peaks. It was revealed that the FCC(200) peak of Ni thin films is the preferred orientation in the range of 5~30 mA/㎠ current density. The intensity of FCC(200) peak was gradually decreased and the intensity of FCC(111) peak was increased with increasing saccharin concentration in the baths.

목차 (Table of Contents)

• Abstract
• 1. 서론
• 2. 실험 방법
• 3. 결과 및 토의
• 4. 결론
• References

참고문헌 (Reference)

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