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Wet chemical etching of stainless steel foil by aqueous ferric chloride solution was investigated in this study. Effects of various process parameters (e.g. etchant agitation rate, etchant temperature, Fe3+ ion concentration, free HCl concentration, s...
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RISS 인기검색어
염화제이철 수용액에 의한 스테인레스 강판의 식각에 관한 연구 = Wet Etching of Stainless Steel Foil by Aqueous Ferric Chloride Solution
한글로보기https://www.riss.kr/link?id=A60047524
- 저자
- 발행기관
- 학술지명
- 권호사항
-
발행연도
2012
-
작성언어
-
- 주제어
-
KDC
500
-
등재정보
SCOPUS,KCI등재,ESCI
-
자료형태
학술저널
- 발행기관 URL
-
수록면
211-216(6쪽)
- DOI식별코드
- 제공처
- 소장기관
-
0
상세조회 -
0
다운로드
부가정보
다국어 초록 (Multilingual Abstract)
Wet chemical etching of stainless steel foil by aqueous ferric chloride solution was investigated in this study. Effects of various process parameters (e.g. etchant agitation rate, etchant temperature, Fe3+ ion concentration, free HCl concentration, specific gravity, etc.) on the etch rate was first studied, and it was found that the etch rate of AK (aluminum- killed) steel, chromium metal and stainless steel (STS430J1L alloy) follows the pseudo-first order reaction equation. When the fatigue ratio of etchant was kept under 16%, sludge was not formed in the solution, and the etched surface showed smooth roughness. The etch rate decreases as Baume of etchant increases, but the effect of free HCl concentration on the etch rate turned out to be minimal. Experimental data were compared with the calculated results from modeled equation, showing very good agreement.
Wet chemical etching of stainless steel foil by aqueous ferric chloride solution was investigated in this study. Effects of various process parameters (e.g. etchant agitation rate, etchant temperature, Fe3+ ion concentration, free HCl concentration, specific gravity, etc.) on the etch rate was first studied, and it was found that the etch rate of AK (aluminum- killed) steel, chromium metal and stainless steel (STS430J1L alloy) follows the pseudo-first order reaction equation. When the fatigue ratio of etchant was kept under 16%, sludge was not formed in the solution, and the etched surface showed smooth roughness. The etch rate decreases as Baume of etchant increases, but the effect of free HCl concentration on the etch rate turned out to be minimal. Experimental data were compared with the calculated results from modeled equation, showing very good agreement.
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