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이 학술지의 논문 검색
Milestones in a Quarter Century of CMP - Plenary
Fury, M.A. Pennington, N.J.; Electrochemical Society 2009 p.3-14
Potential-pH Diagrams of Copper for the Planarization Slurries with Different Complexing Agents
Aksu, S. Pennington, N.J.; Electrochemical Society 2009 p.15-24
Effect of Copper CMP Slurry Chemistry on the Rate of Agglomeration of Alumina Particles
Brahma, N.; Chan, M.; Talbot, J. Pennington, N.J.; Electrochemical Society 2009 p.25-30
Effect of KIO3 on Electrochemical Mechanical Removal of Ta/TaN Films
Govindarajan, R.; Venkataraman, N.; Raghavan, S. Pennington, N.J.; Electrochemical Society 2009 p.31-40
CMP For Direct Wafer Bonding of Hermetically Sealed Cavity Structures
Rhoades, R.L.; Danzl, R. Pennington, N.J.; Electrochemical Society 2009 p.41-50
Effect of Ceria Abrasives on Planarization Efficiency in STI CMP Process
Park, B.; Kim, Y.; Kim, H.; Jeong, H.; Dornfeld, D. Pennington, N.J.; Electrochemical Society 2009 p.51-60
Characterization of Dressing Behaviors and Optimization Technique in Chemical Mechanical Polishing
Chen, K.; Young, H. Pennington, N.J.; Electrochemical Society 2009 p.61-72
CMP Process for Phase Change Materials
Liu, F.; Ge, C.; Xu, K.; Ye, M.; Wang, Y.; Chen, Y.; Xia, S.; Rosenbusch, A.; Duboust, A.; Tu, W. Pennington, N.J.; Electrochemical Society 2009 p.73-82
Post-CMP Cleaning of Copper/Hydrophobic Low-k Dielectric Films
Chen, Y.; Ko, S.; Xu, K.; Wang, Y.; Tu, W.; Karuppiah, L. Pennington, N.J.; Electrochemical Society 2009 p.83-90
NIR Monitoring of CMP Slurries and Post-CMP Cleaning Solutions
Shalyt, E.; Liang, G.; Lu, G.; Bratin, P. Pennington, N.J.; Electrochemical Society 2009 p.91-102