Effect of Ni Interlayer on the Interface Toughening and Thermal Stability of Cu/Al/Cu Clad Composites

다국어 초록 (Multilingual Abstract)

The effect of Ni interlayer on the interface toughening and stability of Cu/Al/Cu clad composite was studied. The peelstrength of Cu/Al/Cu composite with Ni interlayer increased with increase of Ni thickness and reached 10.9 N/mm for thecomposite with 25 μm thick interlayer. The presence of periodic Ni interlayer between Cu and Al hinders the steady crackgrowth along Cu/Al interface and toughen the interface by inducing the crack deflection away from Cu/Al interface. The peelstress-displacement curves of as-roll-bonded clad exhibited the stress undulation and its amplitude increased with increase ofnickel interlayer thickness. The degree of crack deflection was observed to increase with increasing nickel interlayer thickness.
The peel strength of Cu/Al/Cu with 25 μm thick Ni interlayer increased up to 14.5 N/mm after annealing at 200 °C, greaterthan those observed in Cu/Al/Cu with no interlayers. The enhanced Cu/Al bonding and softening of Al matrix by annealingat 200 °C further increased the peel strength because the crack propagated continuously through the ductile Al plate. Theformation of pronounced intermetallic compounds at Cu/Al and Ni/Al interfaces after annealing above 400 °C induced thecrack growth along the layers of brittle intermetallics and reduced the beneficial effects of Ni interlayer.

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