Effect of the Deformation State on the Mechanical Degradation of Cu Metal Films on Flexible PI Substrates During Cyclic Sliding Testing

다국어 초록 (Multilingual Abstract)

The effect that the deformation state exerts on both the electrical and the mechanical degradation of Cu thin film on a flexiblePI substrate was investigated via cyclic sliding test. Two opposite types of deformation (tension and compression) wereapplied to Cu thin film depending on its outward or inward placement in the cyclic sliding test system. During the cyclicsliding test, the change in electrical resistance of the Cu thin films was monitored using a two-point probe method. Systematicsurface observation of deformed Cu thin film under the two opposite types of deformation was performed following specificcycles of sliding motion. Surface observation based on field emission scanning electron microscopy and 3D confocal laserscanning microscopy had been done to quantify the evolution of intrusion extrusions and surface roughness on the deformedCu thin film. The distribution of microcracks significantly depended on the type of stress/strain applied to the Cu thin filmon a flexible PI substrate during the cyclic sliding test. Finite element analysis was performed to explain the deformationbehavior of the Cu thin film on a flexible PI substrate during the cyclic sliding test.

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