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Overview on CMOS MEMS Fabrication Techniques and Applications
Gaitan, M. Washington, D.C.; International Microelectronics and Packaging Society 2001 p.001-006
MEMS in Aerospace Applications - Thermal Control Shutters
Osiander, R.; Champion, J. L.; Darrin, M. A. Washington, D.C.; International Microelectronics and Packaging Society 2001 p.007-013
Fettig, R. K. Washington, D.C.; International Microelectronics and Packaging Society 2001 p.014-019
Micro-Scale Avionics Thermal Management
Moran, M. E. Washington, D.C.; International Microelectronics and Packaging Society 2001 p.020-025
Zero Shrink Process for Cost Sensitive High Volume LTCC Applications
Barker, M. F.; Draudt, R. Washington, D.C.; International Microelectronics and Packaging Society 2001 p.026-031
Gerber, M.; Thompson, T.; O Connor, S. Washington, D.C.; International Microelectronics and Packaging Society 2001 p.032-036
Kim, N. P.; Amirgulyan, N.; Li, K.; Chien, C.-P.; Tanielian, M. H. Washington, D.C.; International Microelectronics and Packaging Society 2001 p.037-043
Development of an Organic Micromachining Process on Silicon for RF/Microwave Applications
Newlin, D.; Pham, A.; Harriss, J.; Lee, J. B. Washington, D.C.; International Microelectronics and Packaging Society 2001 p.044-047
Park, J. Y.; Eo, Y. S.; Bu, J. U.; Jeon, K. I. Washington, D.C.; International Microelectronics and Packaging Society 2001 p.048-051
Moving to Microvias in a High Reliability, Low Production Environment
Folkerts, J.; Falk, P.; Dietrich, A.; Le, B.; Ling, S. Washington, D.C.; International Microelectronics and Packaging Society 2001 p.052-055