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      KCI등재 SCOPUS

      MCPCB의 온도에 따른 고출력 LED의 광학적, 열적 영향력 분석

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      https://www.riss.kr/link?id=A76615575

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      다국어 초록 (Multilingual Abstract)

      In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8 [℃/W] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5 [℃/W] and was decreased 0.72 [℃/W] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.
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      In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitan...

      In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8 [℃/W] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5 [℃/W] and was decreased 0.72 [℃/W] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

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      목차 (Table of Contents)

      • Abstract
      • 1. 서론
      • 2. 이론 및 실험
      • 3. 결과 및 고찰
      • 4. 결론
      • Abstract
      • 1. 서론
      • 2. 이론 및 실험
      • 3. 결과 및 고찰
      • 4. 결론
      • 감사의 글
      • 참고문헌
      • 저자소개
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      참고문헌 (Reference)

      1 N. Holonyak Jr, 1 : 82-, 1962

      2 Takashi Mukai, 189/190 : 778-, 1998

      3 Jeong Park, 29 (29): 2655-, 2004

      4 H. Pape et al, "Thermal transient modeling and experimental validation in the European project PROFIT" 27 (27): 530-538, 2004

      5 Jianzheng Hu, "Thermal and Mechanical Analysis of High-Power LEDs With Ceramic Packages" 8 (8): 2008

      6 Varshni Y.P, "Temperature dependence of the energy gap in semiconductors" 34 : 149-, 1967

      7 Nadarajah Narendran, "Proceedings IESNA Annual Conference: Performance Charateristcs of Light Emitting Diodes"

      8 T. Margalith, "Proc. SPIE 6134"

      9 Jianzheng Hu, "Electrical, optical and thermal degradation of high power GaN/InGaN light-emitting diodes" 41 : 2008

      1 N. Holonyak Jr, 1 : 82-, 1962

      2 Takashi Mukai, 189/190 : 778-, 1998

      3 Jeong Park, 29 (29): 2655-, 2004

      4 H. Pape et al, "Thermal transient modeling and experimental validation in the European project PROFIT" 27 (27): 530-538, 2004

      5 Jianzheng Hu, "Thermal and Mechanical Analysis of High-Power LEDs With Ceramic Packages" 8 (8): 2008

      6 Varshni Y.P, "Temperature dependence of the energy gap in semiconductors" 34 : 149-, 1967

      7 Nadarajah Narendran, "Proceedings IESNA Annual Conference: Performance Charateristcs of Light Emitting Diodes"

      8 T. Margalith, "Proc. SPIE 6134"

      9 Jianzheng Hu, "Electrical, optical and thermal degradation of high power GaN/InGaN light-emitting diodes" 41 : 2008

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2010-10-01 평가 학술지 통합(등재유지)
      2007-01-01 평가 학술지 통합(기타) KCI등재
      2001-01-01 평가 등재학술지 유지(등재유지) KCI등재
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