FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of Φ 10㎚ and smaller is available. Currently FIB i...
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https://www.riss.kr/link?id=A76215337
2005
Korean
550
학술저널
603-607(5쪽)
0
상세조회0
다운로드다국어 초록 (Multilingual Abstract)
FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of Φ 10㎚ and smaller is available. Currently FIB i...
FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of Φ 10㎚ and smaller is available. Currently FIB is not being applied in the fabrication of this micro part because of some problems to redeposition and charging effect of the substrate causing reduction of accuracy with regards to shape and productivity. Furthermore, the prediction of the material removal rate information should be required but it has been insufficient for micro part fabrication.
The paper have the targets that are FIB-CVD characteristic analysis and minimum line pattern resolution achievement for 3D micro fabrication. We make conclusions with the analysis of the results of the experiment according to beam current, pattern size and scanning parameters. CVD of 8 pico ampere shows superior CVD yield but CVD of 1318 pico ampere shows the pattern sputtered. And dwell time is dominant parameter relating to CVD yield.
목차 (Table of Contents)