Recently, it was found that polycrystalline silicon thin film could be easily obtained with AIC (Aluminum Induced Crystallization) phenomenon from a-Si. During the crystallization process, layer exchange was found to take place. However, this thin fil...
Recently, it was found that polycrystalline silicon thin film could be easily obtained with AIC (Aluminum Induced Crystallization) phenomenon from a-Si. During the crystallization process, layer exchange was found to take place. However, this thin film can`t be used as it is for the fabrication of solar cell because of aluminum contamination in the silicon layer. In order to utilize the AIC for the solar cell fabrication, layer exchange should be inhibited. For this purpose, 1 μm aluminum oxide layer was formed first on the aluminum substrate with anodizing process. Wet blasting treatment with ceramic powder was conducted onto this aluminum oxide layer to make the micro hole. A-Si layer was deposited with CVD on the top of this layer to be contacted with aluminum through these micro holes. During heat treatment below 450°C, AIC of a-Si is expected to take place at these holes. XRD study shows that a-Si was crystallized. Without this aluminum oxide layer, most of the silicon atoms were found to be absorbed into aluminum layer during heat treatment. Surface morphology of each step of the process was observed with AFM and cross section of each step of the process was observed with SEM.