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Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects
Cho, S. K.; Lee, J. K.; Kim, S.-K.; Kim, J. J. ELECTROCHEMICAL SOCIETY AND INSTITUTE OF ELECTRONICS ENGINEERS 2007 p.D116-D119
Application of Zr-Si Film as Diffusion Barrier in Cu Metallization
Wang, Y.; Cao, F.; Song, Z.; Zhao, C.-H. ELECTROCHEMICAL SOCIETY AND INSTITUTE OF ELECTRONICS ENGINEERS 2007 p.H299-H301
Majumder, P.; Katamreddy, R.; Takoudis, C. ELECTROCHEMICAL SOCIETY AND INSTITUTE OF ELECTRONICS ENGINEERS 2007 p.H291-H295
Ginestra, C. N.; Sreenivasan, R.; Karthikeyan, A.; Ramanathan, S.; McIntyre, P. C. ELECTROCHEMICAL SOCIETY AND INSTITUTE OF ELECTRONICS ENGINEERS 2007 p.B161-B165
Characteristics of Pentacene Thin Film Transistor with Al~2O~3 Gate Dielectrics on Plastic Substrate
Lim, J. W.; Koo, J. B.; Yun, S. J.; Kim, H.-T. ELECTROCHEMICAL SOCIETY AND INSTITUTE OF ELECTRONICS ENGINEERS 2007 p.J136-J138
Wang, Y.; Yang, W.; Yang, J. ELECTROCHEMICAL SOCIETY AND INSTITUTE OF ELECTRONICS ENGINEERS 2007 p.A233-A236
Damage Reduction and Sealing of Low-k Films by Combined He and NH~3 Plasma Treatment
Urbanowicz, A. M.; Baklanov, M. R.; Heijlen, J.; Travaly, Y.; Cockburn, A. ELECTROCHEMICAL SOCIETY AND INSTITUTE OF ELECTRONICS ENGINEERS 2007 p.G76-G79
Wu, Y. S.; Liao, C.; Peng, W. C. ELECTROCHEMICAL SOCIETY AND INSTITUTE OF ELECTRONICS ENGINEERS 2007 p.J126-J128
Seki, S.; Mita, Y.; Tokuda, H.; Ohno, Y.; Kobayashi, Y.; Usami, A.; Watanabe, M.; Terada, N.; Miyashiro, H. ELECTROCHEMICAL SOCIETY AND INSTITUTE OF ELECTRONICS ENGINEERS 2007 p.A237-A240
Schrebler, R.; Llewelyn, C.; Vera, F.; Cury, P.; Munoz, E.; del Rio, R.; Meier, H. G.; Cordova, R.; Dalchiele, E. A. ELECTROCHEMICAL SOCIETY AND INSTITUTE OF ELECTRONICS ENGINEERS 2007 p.D95-D99