모바일 디스플레이용 유리 기판의 미 식각부 두께 최소화를 위한 습식식각 공정조건 최적화

다국어 초록 (Multilingual Abstract)

The expansion of the display market could mass-produce the product which becomes the super-slim and ultra-lighting according to the demand of customer. This change etched the mobile display panel in order to make the thin glass. The wet etching refers to the process of removing selectively the unnecessary part in order to form the circuit pattern among the semi-conductor or the LCD manufacturing process. The wet etching can progress the etching about a large amount at a time but the thickness of glass is not smooth or not etched according to the process condition. In this study, the defect factor in the etching process tries to be analyze. The experimental design was established and the processing condition was optimized in order to minimize under non-etch part generation by the experiment of design.

목차 (Table of Contents)

• Abstract
• 1. 서론
• 2. 습식 식각 및 공정파라미터
• 2.1 글라스 면취
• 2.2 식각률(Etching rate)
• 2.3 유량
• 3. 실험 및 고찰
• 3.1 다구치 방법
• 3.2 실험 결과 및 분석
• 3.3 회귀분석
• 4. 결론
• References

참고문헌 (Reference)

1 김호태, "저불산 불소계 화합물 수용액을 이용한 글라스 박판화" 한국공업화학회 20 (20): 557-560, 2009

2 류미라, "다구찌 기법을 이용한 베벨기어 사출금형의 최적화" 한국기계기술학회 12 (12): 91-96, 2010

3 김호건, "다구찌 기법을 이용한 가공성에 따른 최적의 공구선정에 관한 연구" 한국기계기술학회 15 (15): 773-777, 2013

4 SAMSUNG DISPLAY CO. LTD, "Wet Etching Apparatus"

5 TAE-YOUNG PARK, "The Cross-industry Spillover of Technological Capability: Korea’s DRAM and TFT-LCD Industries" 36 (36): 2855-2873, 2008

6 FIS Co, "Eching Apparatus With Guide Blade"

7 S.H Park, "Design of experiments" Minyoungsa 2008