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    An Application of DMAIC Method for Incoming Inspection Improvement of the Raw Materials in Semiconductor Assembly Process

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    https://www.riss.kr/link?id=A103794114

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    다국어 초록 (Multilingual Abstract) kakao i 다국어 번역

    The raw materials used in the semiconductor assembly process should be inspected to guarantee the quality. The sample of the raw materials used in the incoming inspection are usually discarded after related incoming inspection. This causes huge material waste and cost raise. For recycling the inspected samples and incoming inspection improvement, in this study, we presented an application of DMAIC (define, measure, analyze, improve, control) method. The application improves the incoming inspection method and operation method used in sample extraction stage, incoming inspection stage (appearance, size, characteristic) and repackage stage to avoid damage (scratch, pollution, deformation) and make the samples recycled as raw materials. In the define phase, the discarding levels (50%) of Lead Frame and PCB (Printed Circuit Board), the main raw materials used in the semiconductor assembly, were obtained. The improving level (reduce 80%) were also forecasted. In the measure phase, the inferior levels of raw material samples were obtained. Function Deployment Matrix (FDM) was used to select the extraction method, jig used in incoming inspections and inspector’s movement for repackage as indicators which have affect on quality. In the analyze phase, through the detail analysis to the selected indicators, the plan for modifying the work table’s construction to minimize the inspector’s movement, the plan for improving the storage method to avoid the scratch, pollution and deformation of the raw material samples, the plan for redeveloping the jig used in the incoming inspection to improve the appearance inspection’s operation method, the plan for improving the microscope’s stage were proposed. In the improve phase, the effect of the proposed plans for the improvements above was confirmed. In the control phase, the effective improvements were made as official incoming inspection rules, the inspection room’s environment was also maintained at the same level with assembly line and established a rule of regular check.
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    The raw materials used in the semiconductor assembly process should be inspected to guarantee the quality. The sample of the raw materials used in the incoming inspection are usually discarded after related incoming inspection. This causes huge materi...

    The raw materials used in the semiconductor assembly process should be inspected to guarantee the quality. The sample of the raw materials used in the incoming inspection are usually discarded after related incoming inspection. This causes huge material waste and cost raise. For recycling the inspected samples and incoming inspection improvement, in this study, we presented an application of DMAIC (define, measure, analyze, improve, control) method. The application improves the incoming inspection method and operation method used in sample extraction stage, incoming inspection stage (appearance, size, characteristic) and repackage stage to avoid damage (scratch, pollution, deformation) and make the samples recycled as raw materials. In the define phase, the discarding levels (50%) of Lead Frame and PCB (Printed Circuit Board), the main raw materials used in the semiconductor assembly, were obtained. The improving level (reduce 80%) were also forecasted. In the measure phase, the inferior levels of raw material samples were obtained. Function Deployment Matrix (FDM) was used to select the extraction method, jig used in incoming inspections and inspector’s movement for repackage as indicators which have affect on quality. In the analyze phase, through the detail analysis to the selected indicators, the plan for modifying the work table’s construction to minimize the inspector’s movement, the plan for improving the storage method to avoid the scratch, pollution and deformation of the raw material samples, the plan for redeveloping the jig used in the incoming inspection to improve the appearance inspection’s operation method, the plan for improving the microscope’s stage were proposed. In the improve phase, the effect of the proposed plans for the improvements above was confirmed. In the control phase, the effective improvements were made as official incoming inspection rules, the inspection room’s environment was also maintained at the same level with assembly line and established a rule of regular check.

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    참고문헌 (Reference)

    1 이원창, "전략 실행력 강화를 위한 6시그마 Right Project 도출방안" 한국기업경영학회 13 (13): 181-194, 2006

    2 박유식, "내부․외부시장지향성이 서비스품질 및 내부․외부고객만족에 미치는 영향" 한국기업경영학회 19 (19): 305-330, 2012

    3 손성진, "기업문화와 TQM, 6시그마 품질경영이 비재무성과와 재무성과에 미치는 효과" 한국경영학회 38 (38): 1691-1719, 2009

    4 임병훈, "가전제품의 주요 국가 간 제품품질 경쟁력 비교에 관한 연구" 한국기업경영학회 19 (19): 131-151, 2012

    5 Pande, L., "What is Six Sigma" McGraw-Hill 2002

    6 Feng, Q., "Under the Knife : A National Survey of Six Sigma Programs in US Healthcare Organizations" 21 (21): 535-547, 2007

    7 Easton, G. S., "The Role of Experience in Six Sigma Project Success : An Empirical Analysis of Improvement Projects" 30 : 481-493, 2012

    8 Chakravorty, S. S., "The Implementation of Design for Six Sigma : A Development Experience" 9 (9): 329-342, 2009

    9 Zimmerman, J. P., "Six Sigma’s Seven Deadly Sins" 44 : 62-66, 2005

    10 Antony, J., "Six Sigma in Small and Medium sized UK Manufacturing Enterprises : Some Empirical Observations" 22 (22): 860-874, 2005

    1 이원창, "전략 실행력 강화를 위한 6시그마 Right Project 도출방안" 한국기업경영학회 13 (13): 181-194, 2006

    2 박유식, "내부․외부시장지향성이 서비스품질 및 내부․외부고객만족에 미치는 영향" 한국기업경영학회 19 (19): 305-330, 2012

    3 손성진, "기업문화와 TQM, 6시그마 품질경영이 비재무성과와 재무성과에 미치는 효과" 한국경영학회 38 (38): 1691-1719, 2009

    4 임병훈, "가전제품의 주요 국가 간 제품품질 경쟁력 비교에 관한 연구" 한국기업경영학회 19 (19): 131-151, 2012

    5 Pande, L., "What is Six Sigma" McGraw-Hill 2002

    6 Feng, Q., "Under the Knife : A National Survey of Six Sigma Programs in US Healthcare Organizations" 21 (21): 535-547, 2007

    7 Easton, G. S., "The Role of Experience in Six Sigma Project Success : An Empirical Analysis of Improvement Projects" 30 : 481-493, 2012

    8 Chakravorty, S. S., "The Implementation of Design for Six Sigma : A Development Experience" 9 (9): 329-342, 2009

    9 Zimmerman, J. P., "Six Sigma’s Seven Deadly Sins" 44 : 62-66, 2005

    10 Antony, J., "Six Sigma in Small and Medium sized UK Manufacturing Enterprises : Some Empirical Observations" 22 (22): 860-874, 2005

    11 Rohini, R., "Six Sigma : Improving the Quality of Operation Theatre" 25 : 273-280, 2011

    12 Lee-Mortimer, A., "Six Sigma : A Vital Improvement Approach When Applied to the Right Problems, in the Right Environment" 26 (26): 10-18, 2006

    13 Sutton, C., "Getting the Most Out of Six Sigma" 46-48, 2006

    14 Foster, S. T., "Does Six Sigma Improve Performance?" 14 (14): 7-20, 2007

    15 Snee, R. D., "Dealing with the Achilles’ Heel of Six Sigma Initiatives-Project Selection is Key to Success" 34 (34): 66-69, 2002

    16 Naumann, E., "Customer Centered Six Sigma Linking Customers Process Improvement and Financial Results" ASQ Quality Press 2001

    17 Coronado, R. B., "Critical Success Factors for the Successful Implementation of Six Sigma Projects in Organizations" 14 (14): 92-99, 2002

    18 Schonberger, R. J., "Best Practices in Lean and Six Sigma Process Improvement" Johen Wiley and Sons 2008

    19 Kim, K. S., "An Empirical Study on the Difference Influence on CSF of Six Sigma to Company Size" Korean Academic Society of Business Administration 1-19, 2008

    20 de Mast, J., "An Analysis of the Six Sigma DMAIC Method from the Perspective of Problem Solving" 139 : 604-614, 2012

    21 Su, C. T., "A Systematic Methodology for the Creation of Six Sigma Projects : A Case Study of Semiconductor Foundry" 34 : 2693-2703, 2008

    22 Yeh, D. Y., "A Modified Two-tuple FLC Model for Evaluating the Performance of SCM : by the Six Sigma DMAIC Process" 7 : 1027-1034, 2007

    23 양승권, "6시그마 성공요인이 경영성과에 미치는 영향" 대한안전경영과학회 9 (9): 117-123, 2007

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    학술지 이력

    학술지 이력
    연월일 이력구분 이력상세 등재구분
    2026 평가 재인증평가 신청대상 (재인증)
    2020-01-01 등재 등재학술지 유지 (재인증) KCI등재
    2017-01-01 등재 등재학술지 유지 (계속평가) KCI등재
    2013-01-01 등재 등재학술지 유지 (등재유지) KCI등재
    2010-01-01 등재 등재학술지 선정 (등재후보2차) KCI등재
    2009-03-13 학회명변경 영문명 : 미등록 -> Korean Corporation Management Association KCI등재후보
    2009-01-01 등재 등재후보 1차 PASS (등재후보1차) KCI등재후보
    2007-01-01 등재 등재후보학술지 선정 (신규평가) KCI등재후보
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    학술지 인용정보

    학술지 인용정보
    기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
    2016 1.56 1.56 1.63
    KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
    1.75 1.7 2.494 0.42
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