1 "Revisiting the removal rate model for oxide CMP, Trans" 127 : 639-, 2005.
2 "Physics and modeling of fundamental CMP phenomena" 175-, 2005.
3 "Pad conditioning in chemical mechanical polishing" 123 : 107-, 2004.
4 "Investigation of High-Pressure Micro Jet Technology as an Alternative to Diamond Conditioning in ILD CMP, Wear, In press" 2005.
5 "Fundamental tribological and removal rate studies of inter-layer dielectric chemical mechanical planarization" 42 : 6371-, 2003.
6 "Effect of pad groove designs on the frictional removal rate characteristics of ILD CMP" 152 : G62-, 2005.
7 "Dispersion number studies in CMP of interlayer dielectric films" 150 : G854-, 2003.
8 "Development and analysis of a high-pressure micro jet pad conditioning system for interlayer dielectric chemical mechanical planarization" 44 : 1225-, 2005.
9 "A theory of pad conditioning for chemical-mechanical polishing" 50 : 1-, 2004.
10 "A new method for evaluating CMP pad surface conditions using digital images" 37-, 2003.
1 "Revisiting the removal rate model for oxide CMP, Trans" 127 : 639-, 2005.
2 "Physics and modeling of fundamental CMP phenomena" 175-, 2005.
3 "Pad conditioning in chemical mechanical polishing" 123 : 107-, 2004.
4 "Investigation of High-Pressure Micro Jet Technology as an Alternative to Diamond Conditioning in ILD CMP, Wear, In press" 2005.
5 "Fundamental tribological and removal rate studies of inter-layer dielectric chemical mechanical planarization" 42 : 6371-, 2003.
6 "Effect of pad groove designs on the frictional removal rate characteristics of ILD CMP" 152 : G62-, 2005.
7 "Dispersion number studies in CMP of interlayer dielectric films" 150 : G854-, 2003.
8 "Development and analysis of a high-pressure micro jet pad conditioning system for interlayer dielectric chemical mechanical planarization" 44 : 1225-, 2005.
9 "A theory of pad conditioning for chemical-mechanical polishing" 50 : 1-, 2004.
10 "A new method for evaluating CMP pad surface conditions using digital images" 37-, 2003.