실험계획법을 이용한 Reel Tape Packaging 공정조건 분석 = Analysis of Reel Tape Packing process conditions using DOE

다국어 초록 (Multilingual Abstract)

Today’s placement machines can pick and place thousands of components per hour with a very high degree of accuracy. The packaged semiconductor chips are inserted into a carrier at regular intervals, covered with a tape to protect the chips from external impact, and supplied in a roll form. These packaging processes also progress rapidly in a consistent direction, affecting the peelback strength between the cover tape and carrier depending on the main process conditions. In this paper, we analyzed the main process variables that affect peelback strength in the reel tape packaging process for packaging semiconductor chips. The main effects and interactions were analyzed. The peelback strength range required in the packaging process was set as the nominal the best characteristics, and the optimum process condition satisfying this was derived.

참고문헌 (Reference)

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