3D IC 열관리를 위한 TSV Liquid Cooling System = TSV Liquid Cooling System for 3D Integrated Circuits

다국어 초록 (Multilingual Abstract)

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

참고문헌 (Reference)

1 "http://www.itrs.net"

2 E. Kim, "Yield Challenges in Wafer Stacking Technology" 48 : 1102-, 2008

3 J. Balachandran, "Wafer-Level Package Interconnect Options" 14 (14): 654-, 2006

4 Y. Kim, "Wafer Warpage Analysis of Stacked Wafers for 3D Integration" 89 : 46-, 2012

5 H. Mizunuma, "Thermal Modeling for 3D-ICs with Integrated Microchannel Cooling" 256-, 2009

6 Y. Wei, "Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components" 126 : 60-, 2004

7 B. Dang, "Revolutionary Nanosilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems" 2007

8 G. Huang, "Power Delivery for 3D Chip Stacks: Physical Modeling and Design Implication" 205-, 2007

9 김은경, "Overview of High Performance 3D-WLP" 한국재료학회 17 (17): 371-375, 2007

10 H. Oprins, "On-chip Liquid Cooling with Integrated Pump Technology" 30 (30): 209-, 2007

11 S. N. Paisner, "Nanotechnology and Mathematical Methods for High-Performance Thermal Interface Materials" Global SMT & Packag 36-, 2008

12 R. Hon, "Multi-Stack Flip Chip 3D Packaging with Copper Plated Through-Silicon Vertical Interconnection" 384-, 2005

13 G. Upadhya, "Micro-Scale Liquid Cooling System for High Heat Flux Processor Cooling Applications" 116-, 2006

14 J. Lee, "Low-Temperature Two-Phase Microchannel Cooling for High-Heat-Flux Thermal Management of Defense Electronics" 32 (32): 453-, 2009

15 T. Brunschwiler, "Interlayer Cooling Potential in Vertically Integrated Packages" 15 : 57-, 2009

16 B. Dang, "Integrated Thermal- Fluidic I/O Interconnects for an On-Chip Microchannel Heat Sink" 27 : 117-, 2006

17 G. Y. Tang, "Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules" 33 (33): 184-, 2010

18 B. Shi, "Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs" 33-, 2012

19 J. W. Joyner, "Global Interconnect Design in a Three-Dimensional System-on-a-Chip" 12 : 367-, 2004

20 J. Li, "Geometric Optimization of a Micro Heat Sink with Liquid Flow" 29 (29): 145-, 2006

21 T. G. Yue, "Fluidic Interconnects in Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules" 2008

22 T. Chen, "Flow Boiling Heat Transfer to a Dielectric Coolant in a Microchannel Heat Sink" 30 (30): 24-, 2007

23 A. Yu, "Fabrication of Silicon Carriers with TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Package" 2008

24 P. S. Lee, "Experimental Study on Laminar Heat Transfer in Microchannel Heat Sink" 379-, 2002

25 G. G. Shahidi, "Evolution of CMOS Technology at 32 nm and Beyond" 2007

26 Jun Xu, "Enhancement of Thermal Interface Materials with Carbon Nanotube Arrays" 49 (49): 1658-, 2006

27 J. H. Lau, "Effects of TSVs (Through-Silicon Vias) on Thermal Performances of 3D IC Integration System- In-Package (SiP)" 52 : 2660-, 2012

28 Y. M. Hung, "Effects of Geometric Design on Thermal Performance of Star-Groove Micro-Heat Pipes" 54 (54): 1198-, 2011

29 J. Darabi, "Development of a Chip-Integrated Micro Cooling Device" 34 (34): 1067-, 2003

30 H. Y. Zhang, "Development of Liquid Cooling Techniques for Flip Chip Ball Grid Array Packages with High Flux Heat Dissipations" 28 (28): 127-, 2005

31 Y. Zhang, "Coupled Electrical and Thermal 3D IC Centric Microfluidic Heat Sink Design and Technology" 2011

32 A. Hamdan, "Characterization of a Liquid-Metal Microdroplet Thermal Interface Material" 35 (35): 1250-, 2011

33 A. J. McNamara, "Characterization of Nanostructured Thermal Interface Materials: A Review" 62 : 2-, 2011

34 J. Vaes, "Challenges of Copper Through Silicon Via (TSV) Metallization for 3D-Stacked IC Integration" 88 (88): 745-, 2011

35 S. C. Mohapatra, "Advances in Liquid Coolant Technologies for Electronics Cooling" 354-, 2005

36 D. Kearney, "A Liquid Cooling Solution for Temperature Redistribution in 3D IC Architectures" 43 (43): 602-, 2012

37 D. Sekar, "A 3D-IC Technology with Integrated Microchannel Cooling" 13-, 2008

38 R. S. List, "3D Wafer Stacking Technology" 18 : 29-, 2002

39 M. Bakir, "3D Heterogeneous Integrated Systems: Liquid Cooling, Power Delivery, and Implementation" 2008

40 N. Khan, "3-D Packaging With Through- Silicon Via (TSV) for Electrical and Fluidic Interconnections" 3 (3): 221-, 2013