For realization of flexible organic light emitting diodes(OLEDs), the thin film encapsulation was required excellent gas barrier property with order of 10-6 (g/m2 day) of water vapor transmission rate (WVTR) and high flexibility. In these properties, ...
For realization of flexible organic light emitting diodes(OLEDs), the thin film encapsulation was required excellent gas barrier property with order of 10-6 (g/m2 day) of water vapor transmission rate (WVTR) and high flexibility. In these properties, organic-inorganic multilayer structure rather than inorganic single layer structure, even when the film bending is excellent. But for stability in the 1mm bending radius of the film thickness of the inorganic barrier should be as thin as possible. The best way for this is extremely thin layer with the atomic layer deposition (ALD) growth of metal oxide film. We prepared organic-inorganic multilayer moisture barrier films on polyimide film (PI) substrate using ALD and plasma enhanced chemical vapor deposition (PECVD). ALD process was utilized for deposition of aluminum oxide thin film to use inorganic layers. plasma polymerized film was used for organic layers deposited by PECVD process. trimethyl aluminum (TMA), ozone and n-hexane were used for precursor of aluminum, oxidant source and monomer of plasma polymerized film, respectively.
WVTR and flexibility were measured by an optical and electrical Ca test and folding test, respectively. For foldable applications, the multilayer structures were tested in a folding machine operating at 1 R folding radius.