IT industry has been rapidly developed with integrated circuit chips. However, it is required to install appropriate cooling system in highly integrated chips due to high heat generation rate. As the temperature in IC-chips increases, the performance ...
IT industry has been rapidly developed with integrated circuit chips. However, it is required to install appropriate cooling system in highly integrated chips due to high heat generation rate. As the temperature in IC-chips increases, the performance decreases and the possibility of mal function increases. Therefore, the research on a more effective cooling system has been widely performed. One of the candidates for the new cooling system is the liquid cooling system using micro-channeled heat sink. In this study, the design of the components for the liquid cooling system was conducted. The performance evaluation of the liquid cooling system was also performed by experimental analysis. The results were compared with other cooling devices with respect to CPU temperature, thermal resistance, and noise. The test conditions were : the input power of 150 W, the pump power of 12 V, the constant temperature and humidity of 35℃, 50%, the background noise of 15.7 dB(A).