P-type Bi2−xSbxTe3:Cum (x = 1.5–1.7 and m = 0.002–0.003) solid solutions were synthesized using encapsulated meltingand were consolidated using hot pressing. The effects of Sb substitution and Cu doping on the charge transport and thermoelectric...
http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
https://www.riss.kr/link?id=A105224126
Woo‑Jin Jung (Korea National University of Transportation) ; Il‑Ho Kim (Korea National University of Transportation)
2018
English
KCI등재,SCI,SCIE,SCOPUS
학술저널
415-421(7쪽)
9
0
상세조회0
다운로드다국어 초록 (Multilingual Abstract)
P-type Bi2−xSbxTe3:Cum (x = 1.5–1.7 and m = 0.002–0.003) solid solutions were synthesized using encapsulated meltingand were consolidated using hot pressing. The effects of Sb substitution and Cu doping on the charge transport and thermoelectric...
P-type Bi2−xSbxTe3:Cum (x = 1.5–1.7 and m = 0.002–0.003) solid solutions were synthesized using encapsulated meltingand were consolidated using hot pressing. The effects of Sb substitution and Cu doping on the charge transport and thermoelectricproperties were examined. The lattice constants decreased with increasing Sb and Cu contents. As the amount ofSb substitution and Cu doping was increased, the electrical conductivity increased, and the Seebeck coefficient decreasedowing to the increase in the carrier concentration. All specimens exhibited degenerate semiconductor characteristics andpositive Hall and Seebeck coefficients, indicating p-type conduction. The increased Sb substitution caused a shift in the onsettemperature of the intrinsic transition and bipolar conduction to higher temperatures. The electronic thermal conductivityincreased with increasing Sb and Cu contents owing to the increase in the carrier concentration, while the lattice thermalconductivity slightly decreased due to alloy scattering. A maximum figure of merit, ZTmax= 1.25, was achieved at 373 Kfor Bi0.4Sb1.6Te3:Cu0.003.
참고문헌 (Reference)
1 S.K. Bux, 46 : 8311-, 2010
2 T.A. McCarthy, 3 : 697-, 1970
3 H. Cailat, 80 : 4442-, 1996
4 L. Hu, 22 : 16484-, 2012
5 H.J. Goldsmid, 32 : 2198-, 1961
6 L.V. Prokof’eva, 43 : 1155-, 2009
7 D. Vasilevskiy, 92 : 2610-, 2002
8 S.Y. Wang, 19 : 1024-, 2011
9 G.R. Miller, 26 : 173-, 1965
10 J. Horak, 47 : 805-, 1986
1 S.K. Bux, 46 : 8311-, 2010
2 T.A. McCarthy, 3 : 697-, 1970
3 H. Cailat, 80 : 4442-, 1996
4 L. Hu, 22 : 16484-, 2012
5 H.J. Goldsmid, 32 : 2198-, 1961
6 L.V. Prokof’eva, 43 : 1155-, 2009
7 D. Vasilevskiy, 92 : 2610-, 2002
8 S.Y. Wang, 19 : 1024-, 2011
9 G.R. Miller, 26 : 173-, 1965
10 J. Horak, 47 : 805-, 1986
11 Z. Stary, 49 : 29-, 1988
12 A. Hashibon, 84 : 144117-, 2011
13 S. Chen, 43 : 1966-, 2014
14 R.O. Carlson, 13 : 65-, 1960
15 H.S. Kim, 3 : 041506-, 2015
16 W.S. Liu, 1 : 577-, 2011
17 M.K. Han, 21 : 11365-, 2011
18 J.L. Cui, 180 : 3583-, 2007
19 H. Li, 576 : 369-, 2013
20 Y.S. Lim, 687 : 320-, 2016
21 Z. Huang, 118 : 19-, 2016
22 J.H. Son, 566 : 168-, 2013
23 G.J. Snyder, 7 : 105-, 2008
24 H. Kohler, 74 : 591-, 1976
25 H.T. Langhammer, 123 : K47-, 1984
26 H.J. Goldsmid, "Thermoelectric Refrigeration" Plenum 43-, 1964
27 Woo-Jin Jung, "Mechanical and Thermoelectric Properties of Bi2−xSbxTe3 Prepared by Using Encapsulated Melting and Hot Pressing" 한국물리학회 69 (69): 1328-1334, 2016
28 H. Scherrer, "Handbook of Thermoelectrics, chap. 19" CRC Press 1995
Low Temperature Diffusion Transformations in Fe–Ni–Ti Alloys During Deformation and Irradiation
Effect of Heat Treatments on Microstructures and Tensile Properties of Cu–3 wt%Ag–0.5 wt%Zr Alloy
학술지 이력
연월일 | 이력구분 | 이력상세 | 등재구분 |
---|---|---|---|
2023 | 평가예정 | 해외DB학술지평가 신청대상 (해외등재 학술지 평가) | |
2020-01-01 | 평가 | 등재학술지 유지 (해외등재 학술지 평가) | ![]() |
2009-12-29 | 학회명변경 | 한글명 : 대한금속ㆍ재료학회 -> 대한금속·재료학회 | ![]() |
2008-01-01 | 평가 | SCI 등재 (등재유지) | ![]() |
2005-01-01 | 평가 | 등재학술지 선정 (등재후보2차) | ![]() |
2004-01-01 | 평가 | 등재후보 1차 PASS (등재후보1차) | ![]() |
2002-01-01 | 평가 | 등재후보학술지 선정 (신규평가) | ![]() |
학술지 인용정보
기준연도 | WOS-KCI 통합IF(2년) | KCIF(2년) | KCIF(3년) |
---|---|---|---|
2016 | 2.05 | 0.91 | 1.31 |
KCIF(4년) | KCIF(5년) | 중심성지수(3년) | 즉시성지수 |
1.03 | 0.86 | 0.678 | 0.22 |