Si 기판연마 성능 향상을 위한 연마패드의 개선

다국어 초록 (Multilingual Abstract)

In this research, a polishing pad for Si polishing has been analyzed in detail, to understand stabilization of polishing performance. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing. Pad surface physical property is also ruled by conditioning tool which add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in Si polishing. Pad surface condition is changed by conditioning tool and dummy run and is stable at final. Stabilized pad surface has stable roughness and increased wettability which can increase probability of abrasive adhesion on pad. And this research, we want to improve polishing performance by analysis of pad surface and artificial machining to make stable pad surface. In this research.