1 "반도체 평탄화 CMP 기술" 100-, 2001.
2 "Sliding Friction" 2000.
3 "Material removal mechanism of oxide and nitride CMP with ceria and silica-based slurries - analysis of slurry particles pre-and post-dielectric CMP" 816 : 921-9212, 2004.
4 "Hydra- tion or steric forces between amphihilic surfaces" 6 : 873-, 1990.
5 "Friction and Wear of Ma- terials" 4-, 1965.
6 "Engineering with polymers" New York 89-, 1983.
7 "Effect of slurry flow rate on pad life during interlayer dielectric CMP" 151 (151): 436-, 2004.
8 "Chemistry and Physics of Solid Surfaces Ⅶ" 1990.
9 "CMP 연마입자의 마찰력과 연마율에 관한 영향" 17 (17): 1049-, 2004.
10 "CMP 결과에 영향을 미치는 마찰 특성에 관한 연구" 17 (17): 1041-, 2004.
1 "반도체 평탄화 CMP 기술" 100-, 2001.
2 "Sliding Friction" 2000.
3 "Material removal mechanism of oxide and nitride CMP with ceria and silica-based slurries - analysis of slurry particles pre-and post-dielectric CMP" 816 : 921-9212, 2004.
4 "Hydra- tion or steric forces between amphihilic surfaces" 6 : 873-, 1990.
5 "Friction and Wear of Ma- terials" 4-, 1965.
6 "Engineering with polymers" New York 89-, 1983.
7 "Effect of slurry flow rate on pad life during interlayer dielectric CMP" 151 (151): 436-, 2004.
8 "Chemistry and Physics of Solid Surfaces Ⅶ" 1990.
9 "CMP 연마입자의 마찰력과 연마율에 관한 영향" 17 (17): 1049-, 2004.
10 "CMP 결과에 영향을 미치는 마찰 특성에 관한 연구" 17 (17): 1041-, 2004.
11 "Adhesion and Friction" 1989.
12 "A molecular theory of friction" 7 : 905-, 1929.
13 "A Study on the Interfacial Cha- racteristics and Its Effect on Material Re- moval in CMP" ph. D. qualifying disserta- tion of Pusan National University 62-, 2003.