1 "The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/Cu and Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of the Solder Microstructure" 30 (30): 1157-1164, 2001
2 "Solder Mechanics" 55-, 1991
3 "Sn-Ag-Cu and Sn-Cu Solders: Interfacial Reactions with Platinum" 56 (56): 45-49, 2004
4 "Pt thin-film metalliza-tion for FC-bonding using SnPb60/40 solder bump metallurgy" 22-25, 1998
5 "Lead-free Solders in Microelectronics" 27 : 95-141, 2000
6 "Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects" 541-549,
7 "Intermetallic Formation between Sn-Ag based Solder Bump and Ni Pad in BGA Package" 9 (9): 1-9, 2002
8 "Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders" 17 (17): 263-266, 2002
9 "Effect of Cu Content on Interfacial Reactions between Sn(Cu) Alloys and Ni/Ti Thin-Film Metallization" 32 (32): 1214-1221, 2003
10 "Dissolution of Au Cu and Ni in a Molten Tin-Lead Solder" 551-557, 1969
1 "The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/Cu and Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of the Solder Microstructure" 30 (30): 1157-1164, 2001
2 "Solder Mechanics" 55-, 1991
3 "Sn-Ag-Cu and Sn-Cu Solders: Interfacial Reactions with Platinum" 56 (56): 45-49, 2004
4 "Pt thin-film metalliza-tion for FC-bonding using SnPb60/40 solder bump metallurgy" 22-25, 1998
5 "Lead-free Solders in Microelectronics" 27 : 95-141, 2000
6 "Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects" 541-549,
7 "Intermetallic Formation between Sn-Ag based Solder Bump and Ni Pad in BGA Package" 9 (9): 1-9, 2002
8 "Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders" 17 (17): 263-266, 2002
9 "Effect of Cu Content on Interfacial Reactions between Sn(Cu) Alloys and Ni/Ti Thin-Film Metallization" 32 (32): 1214-1221, 2003
10 "Dissolution of Au Cu and Ni in a Molten Tin-Lead Solder" 551-557, 1969
11 "Compound growth in platinum/tin-lead solder diffusion couples" 31 : 5479-5486, 1996
12 "-Free Solders for Electronic Packaging" 701-706, 1994