Dry Film Photoresist를 이용한 테프론 PCB 위 미세 피치 솔더 범프 형성 = Formation of Fine Pitch Solder Bumps on Polytetrafluoroethylene Printed Circuit Board using Dry Film Photoresist

다국어 초록 (Multilingual Abstract)

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

참고문헌 (Reference)

1 "전자 패키지 기술" 16 (16): 3-13, 2003

2 "Sensors and Actuators A" 53 : 364-368, 1996

3 "IEEE Transactions on Advanced Packaging" 22 (22): 153-159, 1999

4 "Dry Film Photoresist Processing Technology" Electrochemical Publications Ltd 127-, 2001