마이크로솔더링을 이용한 정전류다이오드 회로 자외선 LED 광원모듈 제작 = Fabrication Of Ultraviolet LED Light Source Module Of Current Limiting Diode Circuit By Using Flip Chip Micro Soldering

다국어 초록 (Multilingual Abstract)

The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

참고문헌 (Reference)

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2 H. H. Kim, 48 : 445-, 2008

3 J. L. Aw, 15 : 219-, 2013

4 박화진, "정전류다이오드를 이용한 COB 타입 LED 광원 및 조명기기 회로" 한국전기전자재료학회 26 (26): 488-492, 2013

5 박화진, "전류세기 조정이 가능한 대전력 발광다이오드 광원 회로용 정전류 다이오드 제작" 한국전기전자재료학회 25 (25): 723-726, 2012

6 유순재, "Development of a Very Small LED Lamp with a Low-Thermal-Resistance Lead Frame for an LCD Backlight Unit" 한국정보디스플레이학회 10 (10): 49-53, 2009