분말충진방법과 가공정도에 따른 Ag/BSCCO 초전도선재의 특성 = Influence of powder packing and deformation on the characteristics of Ag/BSCCO superconductor tape

다국어 초록 (Multilingual Abstract)

We evaluated the effects of processing variables on interface irregularity. microstructure. and resultant Jc of BSCCC superconductor tape. For the tapes made by PIT technique. the degree of interface irregularity was varied with powder packing methods and forming process variables. It was observed that the degree of interface irregularity of the tape by CIP method was more reduced. compared to that of the tape by ram method. In addition. the degree of interface irregularity was promoted with decreasing the dimension of tape during forming process. As the dimension of wire/tape were changed from diameter of 3.25mm to thickness of 200㎛ during forming process. Jc value was observed to be increased by 10 times. It was likely that the improvenment of Jc was mainly result from the enhanced texturing of 2223 grain.
Microstructural investigation showed the degree of texturing was degraded by the existence of both second phases and interface irregularity. If the interface was flat, larger grain size and better texturing near interface were developed compared to those inside superconducting core, The improvements of microstructure near interface may be result of reaction between Ag and superconductor phase.