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Solder Bumping Via Paste Reflow for Area Array Packages
Huang, B.;Lee, N.-C. IEEE Service Center 2002 p.1-17
Semiconductor Backend Flip Chip Processing, Inspection Requirements and Challenges
Asgari, R. IEEE Service Center 2002 p.18-22
Material and Process Considerations for Reliable Overmolded Flip Chip PBGAs
Chan, H.;Alvarez, S. IEEE Service Center 2002 p.23-26
Lead-Free Low-Cost Flip-Chip Process Chain: Layout, Process, Reliability
Wolflick, P.;Feldman, K. IEEE Service Center 2002 p.27-34
Patchwork Smart Power Thick-Film Hybrids for Automotive Under Hood Applications
Wilczek, P. K. IEEE Service Center 2002 p.35-40
Tape Based CSP Package Supports Fine Pitch Wirebonding
Geissinger, J.;Keller, F.;Trevino, S.;Kamei, T. IEEE Service Center 2002 p.41-45
Chip-in-Polymer: Volumetric Packaging Solution Using PCB Technology
Jung, E.;Wojakowski, D.;Landesberger, A. N. C.;Ostmann, A.;Ashenbrenner, R.;Reichl, H. IEEE Service Center 2002 p.46-49
Wafer Level Underfill-Processing and Reliability
Nguyen, L.;Nguyen, H.;Negasi, A.;Tong, Q.;Hong, S. H. IEEE Service Center 2002 p.53-62
Chip Scale Packaging Techniques for RF SAW Devices
Goetz, M.;Jones, C. IEEE Service Center 2002 p.63-66