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이 학술지의 논문 검색
Analysis of Copper Plating Baths - Suppressors and Levellers
Newton, B.;Kaiser, E. Electrochemical Society 2001 p.1-5
Effect of Thiourea on Electrodeposition of Copper from Acid Sulfate Solution
Donepudi, V. S.;Venkatachalapathy, R.;Ozemoyah, P. O.;Prakash, J.;Johnson, C. S. Electrochemical Society 2001 p.6-14
Copper Electroplating onto Silicon Wafers Using High Frequency Acoustic Streaming
Suni, I. I.;Tiwari, C.;Busnaina, A. A.;Lin, H.;Reynolds, H. V.;Neely, C. Electrochemical Society 2001 p.15-22
A Novel Contact Displacement Method for Cu Interconnect Fabrication
Lee, Y.-P.;Hu, T.-C.;Tsai, M.-S.;Feng, M.-S.;Dai, B.-T. Electrochemical Society 2001 p.23-31
Li, Y.;Jindal, A.;Babu, S. V. Electrochemical Society 2001 p.32-46
Lee, W.;Byun, I.-J.;Seo, B.;Lee, J. Electrochemical Society 2001 p.47-53
Some Effects of Hydrogen on Cu(TMVS)(HFAC) Sourced CVD of Copper Films
Hong, J.;Srinivas, S.;Yang, D.;Cale, T. S. Electrochemical Society 2001 p.54-62
Copper Dry Etching Using and Inductively Coupled O~2 Plasma and Hexafluoroacytylacetone
Lee, W.;Yang, H.;Lee, J. Electrochemical Society 2001 p.63-68
Menini, R.;Brown, H. Electrochemical Society 2001 p.69-79
Copper and Silver Inks for Ink Jet Printing
Rivkin, T.;Curtis, C. J.;Miedaner, A.;Alleman, J.;Schulz, D. L.;Ginley, D. S. Electrochemical Society 2001 p.80-89