Optimization of TLPS Bonding Process and Joint Property using Ni-Sn Paste for High Temperature Power Module Applications|RISS 상세보기

다국어 초록 (Multilingual Abstract)

Recently, as interest in eco-friendly vehicles such as electric and hybrid vehicles increases, the demand for power semiconductors, a key component, is also increasing. Power semiconductors convert, distribute, and control power and operate in harsh environments such as high temperature and high pressure. In order to ensure stable reliability in such harsh environments, research on a technology that can stably form joints even at high temperatures is essential.
Transitional liquid phase (TLP) bonding was proposed as a high-temperature power semiconductor chip bonding technology, which has the advantage of forming an intermetallic compound (IMC) phase with a high melting point at the joint. However, it takes a long time to convert the joint into full IMC phase. Therefore, in this study, in order to shorten the process time, a paste was manufactured by mixing high-melting point Ni metal powder and low-melting point Sn metal power, and a joint was formed through a TLPS (Transition liquid phase sintering) bonding using the paste. Pastes of different compositions were prepared by adjusting the ratio of Ni and Sn powders. The chip and substrate were bonded through a thermocompression (TC) bonding process, and the highest shear strength was obtained at a bonding temperature of 250 ℃ for 10 min. Heat treatment was performed at 200 ℃ for up to 500 h to evaluate the high temperature long-term reliability of the joints. The Ni-Sn TLPS bonded joints remained reliable joints after a long-term aging test at a high temperature of 200 ℃.

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참고문헌 (Reference)

1 노명훈 ; Hiroshi Nishikawa ; 정재필 ; 김원중, "Trasient Liquid Phase bonding for Power Semiconductor" 24 (24): 27-34, 2017

2 윤정원 ; 정소은, "Transient Liquid Phase Sinter Bonding with Tin-Nickel Micro-sized Powders for EV Power Module Applications" 28 (28): 71-79, 2021

3 이정현 ; 정도현 ; 정재필, "Transient Liquid Phase Diffusion Bonding Technology for Power Semiconductor Packaging" 25 (25): 9-15, 2018

4 정도현 ; 노명환 ; 이준형 ; 김경흠 ; 정재필, "Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation" 24 (24): 17-25, 2017

5 F. Blaabjerg, "Reliability of Power Electronic Systems for EV/HEV Applications" 109 (109): 1060-1076, 2021

6 F. Yu, "Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications" 32 (32): 7083-7095, 2017

7 이동환 ; 허민행 ; 윤정원, "Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles" 40 (40): 233-241, 2022

8 윤정원 ; 방정환 ; 고용호 ; 유세훈 ; 김준기 ; 이창우, "Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications" 21 (21): 1-13, 2014

9 Ghosh. A, "Possibilities and Challenges for the Inclusion of the Electric Vehicle (EV) to Reduce the Carbon Footprint in the Transport Sector: A Review" 13 (13): 2602-, 2020

10 K. Shahzad, "Low-carbon technologies in automotive industry and decarbonizing transport" 591 : 233888-, 2024