Research on novel semiconductor materials to replace Si, including the use of 2D materials as channels, is actively being conducted. However, there have been very few studies on the effects of 2D transistor variables, such as parasitic resistances and...
Research on novel semiconductor materials to replace Si, including the use of 2D materials as channels, is actively being conducted. However, there have been very few studies on the effects of 2D transistor variables, such as parasitic resistances and their relation to RF applications. Here we report a systematic study of those effects on electrical performance depending on the transistor structure. It is found that the access resistance and contact resistance are the dominant factors leading to degradation of the device performance, especially in deep scaled devices. A guideline for device structural parameter design for required RF performance is discussed.