Embedded passive devices were developed with thin-film multichip module-deposited (MCM-D) technology. The features of integrated passives are NiCr resistors with 20Ω/square, compact spiral inductors with inductance ranging from 3 to 10 nH, and 900A ...
Embedded passive devices were developed with thin-film multichip module-deposited (MCM-D) technology. The features of integrated passives are NiCr resistors with 20Ω/square, compact spiral inductors with inductance ranging from 3 to 10 nH, and 900A SiNx MIM capacitors with scalable capacitance as well as high breakdown voltage.