CuO 세라믹스의 소결 온도 및 분위기에 따른 미세구조와 수축거동 변화 = Effect of the Sintering Temperature and Atmosphere on the Microstructural Evolution and Shrinkage Behavior of CuO Ceramics

다국어 초록 (Multilingual Abstract)

In this study, the densification behavior and microstructural evolution of CuO were examined when this material was sintered at different temperatures in $O_2$, air and Ar atmospheres. The CuO samples maintained their phases even after prolonged sintering at $900-1100^{\circ}C$ in an oxygen atmosphere. When sintering in air, the densification was faster than it was when sintering in oxygen. However, when the samples were sintered at $1100^{\circ}C$, large pores were observed in the sample due to the phase transformation from CuO to $Cu_2O$ which accompanies the generation of oxygen gas. The pore channels in the sample became narrower as the sintering time increased, eventually undergoing a Rayleigh breakup and forming discrete isolated pores. On the other hand, CuO sintering in Ar did not contribute to the densification, as all CuO samples underwent a phase transformation to $Cu_2O$ during the heating process.

참고문헌 (Reference)

1 S. Suzuki, "p-type Semiconducting Cu2O-CoO Thin Films Prepared by Magnetron Sputtering" 21 : 1336-1341, 2003

2 G. C. Wood, "The Influence of an Intermediate Annealing Treatment on the Oxidation of Copper and Nickel" 14 : 187-205, 1980

3 S. Suda, "The Effect of Atmosphere and Doping on Electrical Conductivity of CuO" 31 : 2488-2491, 1992

4 F. A. Nichols, "Surface-(interface-) and Volume-diffusion Contributions to Morphological Changes Driven by Capillarity" 233 : 1840-1848, 1965

5 J.-H. Song, "Preparation and Sinterability of Nanosize TiO2 Powders using Supercritical Fluids" 37 (37): 625-631, 2000

6 최경만, "Nonstoichiometry and electrical conduction of CuO" PERGAMON-ELSEVIER SCIENCE LTD 57 (57): 81-84, 199601

7 T. Serin, "Multiphonon Hopping of Carriers in CuO Thin Films" 406 : 3551-3555, 2011

8 F. F. Lange, "Morphological Changes of an Intergranular Thin Film in a Polycrystalline Spinel" 65 : 502-506, 1982

9 N. Kikuchi, "Mechanisms of Carrier Generation and Transport in Ni-doped Cu2O" 80 : 756-760, 2006

10 J.-S. Kim, "Low Temperature Sintering Properties of the 0.6TiTe3O8-0.4MgTiO3 Ceramics with Sintering Adds" 114-115, 2007

11 Y. Zhu, "Influence of Oxide Grain Morphology on Formation of The CuO Scale during Oxidation of Copper at 600-1000 oC" 47 : 537-544, 2005

12 B. L. Gehman, "Influence of Manufacturing Process of Indium Tin Oxide Sputtering Targets on Sputtering Behavior" 220 : 333-336, 1992

13 J. Roedel, "High-temperature Healing of Lithographically Introduced Cracks in Sapphire" 73 : 592-601, 1990

14 R. D. Schmidt-Whitley, "Growth and Microstructural Control of Single Crystal Cuprous Oxide Cu2O" 23 : 113-120, 1974

15 T. Serin, "Extraction of Important Electrical Parameters of CuO" 406 : 575-578, 2011

16 N. Kikuchi, "Electrical and Structural Properties of Ni-doped Cu2O Films Prepared by Pulsed Laser Deposition" 486 : 33-37, 2005

17 A. Chen, "Controlled Growth and Characteristics of Single-phase Cu2O and CuO Films by Pulsed Laser Deposition" 83 : 927-930, 2009

18 J. W. Noh, "Collapse of Interconnected Open Pores in Solid State Sintering of W-Ni" 23 : 2141-2145, 1992

19 J. A. Rebane, "An Experimental Study of Copper Self-diffusion in CuO, Y2Cu2O5 and YBa2Cu3O7-x by Secondary Neutral Mass Spectrometry" 7 : 2085-2089, 1997

20 H. H. Yu, "An Axisymmetric Model of Poregrain Boundary Separation" 47 : 1131-1155, 1999